Samsung display co., ltd. (20240121925). DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE simplified abstract
Contents
- 1 DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
Organization Name
Inventor(s)
HYUN JOON Oh of Yongin-si (KR)
DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240121925 titled 'DISPLAY DEVICE, FUNCTIONAL LAYER INCLUDED IN DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
Simplified Explanation
The display device described in the patent application includes a display panel that shows images, along with a functional layer positioned beneath the display panel. The functional layer consists of an adhesive layer, a first heat dissipation layer, a cushion layer containing heat-conducting particles, and a second heat dissipation layer.
- Adhesive layer: Positioned below the display panel to provide adhesion and support.
- First heat dissipation layer: Located below the adhesive layer to dissipate heat effectively.
- Cushion layer: Positioned below the first heat dissipation layer and contains heat-conducting particles for improved heat distribution.
- Second heat dissipation layer: Positioned below the cushion layer to further dissipate heat and maintain optimal temperature levels.
Potential Applications
The technology described in this patent application could be applied in various display devices such as smartphones, tablets, laptops, and televisions to enhance heat dissipation and improve overall performance.
Problems Solved
This technology addresses the issue of heat buildup in display devices, which can lead to performance issues and reduced lifespan. By incorporating multiple heat dissipation layers and a cushion layer with heat-conducting particles, this innovation effectively manages heat and ensures optimal device operation.
Benefits
- Improved heat dissipation - Enhanced device performance - Extended device lifespan
Potential Commercial Applications
The technology could be utilized in the manufacturing of consumer electronics, medical devices, automotive displays, and industrial equipment to enhance heat management and overall device performance.
Possible Prior Art
One possible prior art could be the use of heat dissipation layers in display devices, but the specific combination of layers and materials described in this patent application may be a novel approach to addressing heat buildup in such devices.
Unanswered Questions
How does this technology compare to existing heat dissipation solutions in display devices?
The article does not provide a direct comparison with existing heat dissipation solutions in display devices, leaving the reader to wonder about the specific advantages and drawbacks of this technology in relation to current solutions.
What impact could this technology have on the design and manufacturing process of display devices?
The article does not delve into the potential implications of implementing this technology on the design and manufacturing process of display devices, leaving the reader curious about the practical aspects of integrating this innovation into existing production methods.
Original Abstract Submitted
a display device includes a display panel which displays an image, and a functional layer disposed below the display panel. the functional layer includes an adhesive layer disposed below the display panel, a first heat dissipation layer disposed below the adhesive layer, a cushion layer disposed below the first heat dissipation layer, and including a heat-conducting particle, and a second heat dissipation layer disposed below the cushion layer.
