View source for SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME: abstract simplified (17984446)

*This abstract for appeared for patent application  number 17984446 Titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'

==Simplified Explanation==

The abstract describes a semiconductor device and its fabrication method. The device includes a pad on a semiconductor chip, a protective layer with an opening exposing part of the pad's top surface, and a bump structure connecting to the pad. The bump structure consists of a metal layer on the pad and a solder ball on top. The width of the metal layer is approximately 0.85 to 0.95 times the width of the opening.


==Original Abstract Submitted==

Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a pad on a semiconductor chip, a protective layer on the semiconductor chip and having an opening that exposes a portion of a top surface of the pad, and a bump structure electrically connected to the pad. The bump structure includes a metal layer on the pad and a solder ball on the metal layer. A first width of the metal layer is about 0.85 times to about 0.95 times a second width of the opening.