SAMSUNG ELECTRONICS CO., LTD. patent applications published on November 30th, 2023

Summary of the patent applications from SAMSUNG ELECTRONICS CO., LTD. on November 30th, 2023

Samsung Electronics Co., Ltd. has recently filed several patents related to semiconductor devices and electronic devices. These patents cover various aspects of memory devices, semiconductor structures, and flexible displays.

In terms of memory devices, Samsung has filed patents for self-selecting memory devices with stacked memory cells, semiconductor memory devices with specific components and features, and semiconductor memory devices with active patterns arranged in a grid-like pattern. These patents describe the structures and configurations of these memory devices, including the arrangement of memory cells, conductive lines, electrodes, and insulating layers.

In the field of semiconductor structures, Samsung has filed patents for semiconductor devices with specific structures and configurations. These patents describe the arrangement of source/drain regions, gate electrodes, gate dielectric layers, and complementary structures in single crystal semiconductor patterns. Additionally, Samsung has filed patents for semiconductor devices with bit line structures, including the placement of bit line structures, semiconductor patterns, insulating interlayer patterns, word lines, and capacitors.

Samsung has also filed patents for electronic devices with flexible displays. These patents describe the design of electronic devices with two housings, where the second housing can slide relative to the first housing. The flexible display is attached to supports in the first housing and can be withdrawn or inserted into the device while being supported by the second support. The device includes a motor assembly for sliding the second housing and a thermal conductive member for heat dissipation.

Summary of notable applications:

• Self-selecting memory devices with stacked memory cells and conductive lines.
• Semiconductor memory devices with specific components and features, including hydrogen diffusion barrier layers.
• Semiconductor memory devices with active patterns arranged in a grid-like pattern.
• Semiconductor devices with specific structures and configurations, including complementary structures.
• Semiconductor devices with bit line structures and insulating interlayer patterns.
• Electronic devices with flexible displays that can slide in and out of the device.