Robert bosch gmbh (20240136343). SEMICONDUCTOR MODULE simplified abstract
Contents
- 1 SEMICONDUCTOR MODULE
SEMICONDUCTOR MODULE
Organization Name
Inventor(s)
Felix Stewing of Steinheim (DE)
SEMICONDUCTOR MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136343 titled 'SEMICONDUCTOR MODULE
Simplified Explanation
The semiconductor module described in the abstract includes a semiconductor switch and a capacitor component with a lateral finger structure. The capacitor component is integrated into the semiconductor module and includes a semiconductor substrate, first electrodes, and second electrodes that are formed alternatingly next to one another at a predefined distance. These electrodes are configured to be contacted individually from outside the capacitor component via respective contacting regions.
- The capacitor component in the semiconductor module has a lateral finger structure.
- The first electrodes and second electrodes have identical basic forms and are formed on the semiconductor substrate.
- The electrodes are electrically connected to the semiconductor switch via respective contacting regions.
- The capacitor component and semiconductor switch are integrated into the semiconductor module.
Potential Applications
This technology could be applied in power electronics, renewable energy systems, electric vehicles, and industrial automation.
Problems Solved
This technology solves the problem of integrating a capacitor component with a semiconductor switch in a compact and efficient manner.
Benefits
The integration of the capacitor component and semiconductor switch into a semiconductor module reduces space requirements, improves efficiency, and enhances overall performance.
Potential Commercial Applications
The potential commercial applications of this technology include power converters, motor drives, energy storage systems, and grid-tied inverters.
Possible Prior Art
One possible prior art could be the integration of capacitors and semiconductor switches in power electronic modules for various applications.
Unanswered Questions
How does this technology compare to traditional power electronic modules in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and traditional power electronic modules.
What are the potential challenges in scaling up the production of semiconductor modules with integrated capacitor components?
This article does not address the potential challenges in scaling up production.
Original Abstract Submitted
a semiconductor module. the semiconductor module includes: at least one semiconductor switch and a capacitor component, wherein the capacitor component has a lateral finger structure and includes a semiconductor substrate, at least two first electrodes, at least two second electrodes. the first electrodes and the second electrodes respectively have identical basic forms and are formed alternatingly next to one another at a predefined distance within and/or on the semiconductor substrate and are configured to be contacted individually from outside the capacitor component via respective contacting regions. at least a portion of the first electrodes and of the second electrodes is electrically connected via respective contacting regions of the capacitor component to respective contacting regions of the semiconductor switch, and the capacitor component and the semiconductor switch are integrated into the semiconductor module.
