Robert bosch gmbh (20240132342). LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES simplified abstract
Contents
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Organization Name
Inventor(s)
Holger Rumpf of Reutlingen (DE)
Charles Tuffile of Swansea MA (US)
Stephanie Karg of Stuttgart (DE)
Tobias Joachim Menold of Weil der Stadt (DE)
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240132342 titled 'LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Simplified Explanation
The abstract describes a method of sealing a venthole in a micromechanical device using laser irradiation. The process involves applying a laser pulse to the substrate of the device, causing a portion of the substrate to melt and seal the venthole laterally from beneath the upper surface.
- Micromechanical device sealed with laser irradiation:
* A laser pulse is applied to the substrate of the device. * Melting of the substrate occurs, closing off and sealing the venthole laterally. * The venthole is located in a chamber containing a device, with a trench offset from it.
- Potential Applications:**
This technology could be used in the manufacturing of various micromechanical devices, such as sensors, actuators, and microfluidic systems.
- Problems Solved:**
This technology solves the problem of sealing ventholes in micromechanical devices without the need for additional materials or complex processes.
- Benefits:**
- Simplifies the sealing process of ventholes in micromechanical devices. - Ensures a reliable and efficient seal. - Reduces the risk of contamination or damage to the device.
- Potential Commercial Applications:**
"Sealing Ventholes in Micromechanical Devices Using Laser Irradiation" - A Cost-Effective Solution for Device Manufacturing
- Possible Prior Art:**
Prior art may include methods of sealing ventholes in micromechanical devices using different techniques such as chemical deposition or physical barriers.
- Unanswered Questions:**
- 1. How does the laser irradiation affect the overall performance and durability of the micromechanical device?**
- Answer: The article does not provide specific details on the impact of laser irradiation on the device's performance and durability. Further research or testing may be needed to address this question.
- 2. Are there any limitations or constraints in the size or type of ventholes that can be sealed using this method?**
- Answer: The abstract does not mention any limitations or constraints regarding the size or type of ventholes that can be sealed with laser irradiation. Additional information or experimentation may be required to determine any restrictions in this regard.
Original Abstract Submitted
a venthole of a micromechanical device is sealed with laser irradiation. a micromechanical device has a substrate, such as silicon. the substrate has an upper surface, and defines a venthole leading to a chamber that contains a device, and a trench extending downward from the upper surface and located offset from the venthole. a laser pulse is applied to the substrate at or within the trench. this causes a portion of the substrate located below the upper surface to melt and travel laterally to close off and seal the venthole laterally from beneath the upper surface.
