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| − | '''Summary of the patent applications from Murata Manufacturing Co., Ltd. on October 5th, 2023'''
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| − | Murata Manufacturing Co., Ltd. has recently filed patents for various electronic component packages, radio-frequency modules, circuit boards, circuit modules, switching circuits, filters, and filter devices. These patents aim to improve detection accuracy, reduce size, improve isolation between components, shield electromagnetic waves, and provide simplified and efficient switching and filtering solutions.
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| − | Notable applications of these patents include:
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| − | * Electronic component package with recesses and protrusions for improved contact with electronic components.
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| − | * Radio-frequency module with chip inductor and directional coupler for improved detection accuracy and reduced size.
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| − | * Radio-frequency module with metal member, metal layers, and resin layer for improved isolation between components.
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| − | * Circuit board with multiple layers of insulating and conductive material, including aligned conductor layers with proximity distance.
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| − | * Circuit module with main board, submodule, and shield patterns for electromagnetic wave shielding.
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| − | * Radio-frequency circuit with transmit filters, power amplifiers, and switch circuits for signal transmission.
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| − | * Switching circuit with multiple terminals and switches for efficient electrical connection switching.
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| − | * Hybrid filter with acoustic wave resonator elements, inductors, and capacitor for wider pass band.
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| − | * Filter device with ladder filter circuit, grounded resonator, and capacitor for signal filtering.
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| − | * Composite filter device with ladder filter and bandpass filter for specific expression-based duty requirements.
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| − | Overall, Murata Manufacturing Co., Ltd. has been actively filing patents for various electronic components, modules, circuits, and filters to improve performance, size, isolation, shielding, switching, and filtering capabilities. These innovations demonstrate the company's commitment to advancing technology in the field of electronic components and systems.
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| | ==Patent applications for Murata Manufacturing Co., Ltd. on October 5th, 2023== | | ==Patent applications for Murata Manufacturing Co., Ltd. on October 5th, 2023== |
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| | '''Inventor''' | | '''Inventor''' |
| | Masahiro SASAKI | | Masahiro SASAKI |
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| − | '''Brief explanation'''
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| − | This abstract describes a device that can acquire biological information from a living body. The device consists of two parts: a biometric sensor part that detects biological information and a living-body wearable part that allows the sensor to be in contact with the body. There is also a main body part that processes the biological information and supplies power through a battery. The biometric sensor part can be replaced and separated from the main body part. When the sensor part is worn on the body, the main body part is detachably attached to it without coming into contact with the body.
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| − |
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| − | '''Abstract'''
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| − | A biological-information acquisition device is provided that includes a biometric sensor part including a biometric sensor that detects biological information and a living-body wearable part that enables the biometric sensor part to be in contact with a living body and a main body part including an information processing section that processes biological information and a battery that supplies power. The biometric sensor part is configured to be replaceable by being separated from the main body part, and the main body part is detachably attached to the biometric sensor in such a manner as not to come into contact with a living body when the biometric sensor part is worn on the living body.
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| | ===FLUID CONTROL DEVICE (18327196)=== | | ===FLUID CONTROL DEVICE (18327196)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Yutoku KAWABATA | | Yutoku KAWABATA |
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| − | '''Brief explanation'''
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| − | The abstract describes a device consisting of two main plates and a piezoelectric element. The first main plate has two surfaces and the second main plate has two surfaces and an opening. The piezoelectric element causes vibrations in the first main plate. A frame surrounds the first main plate and connects it to the second frame. The frames have connecting portions that create openings, allowing air to flow between the spaces adjacent to the surfaces of the main plates.
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| − | '''Abstract'''
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| − | A first main plate has a first principal surface and a second principal surface. A second main plate has a third principal surface, a fourth principal surface, and an aperture. A piezoelectric element is provided on the first main plate and vibrates the first main plate. A first frame is disposed outside an outer peripheral end of the first main plate. First connecting portions connect the first main plate and the first frame to each other. Apertures are formed between the first connecting portions and connect a space adjacent to the first principal surface and a space adjacent to the second principal surface to each other. The second frame is disposed outside an outer peripheral end of the first frame. A second connecting portion connects the first frame and the second frame to each other.
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| | ===POWER AMPLIFIER CIRCUIT (18327343)=== | | ===POWER AMPLIFIER CIRCUIT (18327343)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Terukazu NAGAKURA | | Terukazu NAGAKURA |
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| − | '''Brief explanation'''
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| − | The abstract describes a circuit configuration that includes a storage element, a transistor, and a control circuit. The storage element is connected in series between the ground and a power supply terminal. The first transistor is also connected in series with the storage element between the power supply terminal and the ground.
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| − | The first control circuit is responsible for supplying a control voltage to the gate of the first transistor through the storage element. The control voltage has two different voltage values depending on the voltage of the power supply.
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| − | When the power supply voltage is at a specific value that is intended to change the resistance value of the storage element, the first control circuit supplies the gate of the first transistor with a control voltage having a first voltage value.
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| − | On the other hand, when the power supply voltage is at a different specific value that is meant for reading out the resistance value of the storage element, the first control circuit supplies the gate of the first transistor with a control voltage having a second voltage value. This second voltage value has a greater absolute value compared to the first voltage value.
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| − | '''Abstract'''
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| − | A storage element is connected in series between the ground and a power supply terminal supplied with a power-supply voltage. A first transistor is connected in series to the storage element between the power supply terminal and the ground. A first control circuit supplies the gate of the first transistor with a first control voltage through the storage element. When the power-supply voltage has a voltage value for changing the resistance value of the storage element, the first control circuit supplies the gate of the first transistor with the first control voltage having a first voltage value. When the power-supply voltage has a voltage value for reading out the resistance value of the storage element, the first control circuit supplies the gate of the first transistor with the first control voltage having a second voltage value whose absolute value is greater than that of the first voltage value.
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| | ===COIL COMPONENT (18189667)=== | | ===COIL COMPONENT (18189667)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Keiichi ISHIDA | | Keiichi ISHIDA |
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| − | '''Brief explanation'''
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| − | The abstract describes a coil component that consists of an element assembly with a coil conductor and a magnetic portion. The coil conductor is made by winding a conductor coated with an insulating film, and the magnetic portion contains metal magnetic particles and resin. There is also an outer electrode that is electrically connected to the exposed surface of the coil conductor. The metal magnetic particles are divided into two types: first and second metal magnetic particles. The size distribution of these particles, calculated from a cross-sectional image of the magnetic portion, shows at least two peaks and at least one bottom. The first magnetic particles are larger than or equal to the bottom with the minimum frequency, while the second metal magnetic particles are smaller than this bottom.
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| − | '''Abstract'''
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| − | A coil component includes an element assembly including a coil conductor formed by winding a conductor coated with an electrically insulating film and a magnetic portion containing metal magnetic particles and resin, and an outer electrode electrically connected to an exposed surface, exposed on a surface of the element assembly, of an extended part of the coil conductor and disposed on a surface of the element assembly. The metal magnetic particles include first and second metal magnetic particles. A particle size distribution of the magnetic particles, calculated in accordance with a circle equivalent diameter obtained from a cross-sectional image in a cross section of the magnetic portion, has at least two peaks and at least one bottom. The first magnetic particles are larger than or equal to the bottom having a minimum frequency, and the second metal magnetic particles are smaller than the bottom having the minimum frequency.
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| | ===EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS (18024607)=== | | ===EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS (18024607)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Takayuki TANGE | | Takayuki TANGE |
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| − | '''Brief explanation'''
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| − | The abstract describes a device that consists of a substrate, a magnetic core with a hole, and two windings. The first winding goes through the hole and wraps around the magnetic core. The second winding also goes through the hole, wraps around the magnetic core, and goes around a part of the first winding. Importantly, both windings only go around one half of the magnetic core.
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| − | '''Abstract'''
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| − | A device includes a substrate; a magnetic core in the substrate and including a hole; a first winding extending through the hole and around the magnetic core; and a second winding extending through the hole, around the magnetic core, and around a portion of the first winding. The first and the second windings only extend around the same half of the magnetic core.
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| | ===COIL COMPONENT (18184579)=== | | ===COIL COMPONENT (18184579)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Kozo SATO | | Kozo SATO |
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| − | '''Brief explanation'''
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| − | The abstract describes a coil component that is made up of multiple layers. It consists of an element assembly containing a magnetic material, a coil embedded within the element assembly, an outer electrode connected to the coil and located on the bottom surface of the element assembly, and an insulating layer also on the bottom surface. The insulating layer has a hollow space, and the outer electrode is placed inside this hollow space.
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| − | '''Abstract'''
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| − | A coil component that is a multilayer coil component includes an element assembly containing a magnetic material, a coil embedded in the element assembly, an outer electrode electrically coupled to the coil and disposed on a bottom surface of the element assembly, and an insulating layer disposed on the bottom surface of the element assembly. The insulating layer has a cavity, and the outer electrode is disposed in the cavity.
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| | | | |
| | ===LAMINATED COIL COMPONENT (18191854)=== | | ===LAMINATED COIL COMPONENT (18191854)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Shoyo YAMADA | | Shoyo YAMADA |
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| − | '''Brief explanation'''
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| − | The abstract describes a laminated coil component that consists of a body with insulating layers stacked on top of each other. Inside the body, there is a coil made up of coil conductors that are connected by a via conductor that goes through the insulating layers. On the surface of the body, there is an outer electrode that is connected to the coil. The coil conductors have a specific arrangement, with a first laminated part that includes adjacent coil conductors, including the outermost coil conductor. This first laminated part has parallel sections where all the coil conductors overlap each other when viewed in the stacking direction. These parallel sections are connected in parallel by the via conductor, and the outermost coil conductor is connected to the outer electrode through first and second lead-out conductors.
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| − | '''Abstract'''
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| − | A laminated coil component including a body in which insulating layers are laminated in a laminating direction; a coil in the body; and an outer electrode on a surface of the body and electrically connected to the coil. The coil includes coil conductors laminated in the laminating direction that are electrically connected by a via conductor that penetrates the insulating layers in the laminating direction. The coil conductors include a first laminated part including adjacent coil conductors including an outermost coil conductor at an outermost position in the laminating direction. The first laminated part has first parallel sections in which all of the coil conductors of the first laminated part overlap each other when viewed in the laminating direction. The first parallel sections are connected in parallel by the via conductor, and the outermost coil conductor is electrically connected to the same outer electrode by first and second lead-out conductors.
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| | ===ELECTRONIC COMPONENT (18332188)=== | | ===ELECTRONIC COMPONENT (18332188)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Yosuke MATSUSHITA | | Yosuke MATSUSHITA |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component that consists of multiple insulating layers stacked together. One of the insulating layers has a first surface, on which there are two conductor pattern portions. A first interlayer connection conductor is placed either through the first insulating layer or a second insulating layer, which is in contact with the first surface. The first conductor pattern portion has a specific region designed for connection to the first interlayer connection conductor. Ultimately, the first interlayer connection conductor is connected to the first conductor pattern portion.
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| − | '''Abstract'''
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| − | An electronic component includes a stacked body in which a plurality of insulating layers are stacked, wherein the plurality of insulating layers include a first insulating layer having a first surface. A first conductor pattern portion and a second conductor pattern portion adjacent to the first conductor pattern portion are disposed on the first surface. A first interlayer connection conductor is disposed to extend through one of the first insulating layer and a second insulating layer in a thickness direction of the stacked body, the second insulating layer being an insulating layer in contact with the first surface as one of the plurality of insulating layers. The first conductor pattern portion has a first region for connection to the first interlayer connection conductor. The first interlayer connection conductor is connected to the first conductor pattern portion.
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| | | | |
| | ===COIL COMPONENT (18186755)=== | | ===COIL COMPONENT (18186755)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Shoichiro FURUKAWA | | Shoichiro FURUKAWA |
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| − | '''Brief explanation'''
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| − | The abstract describes a coil component that consists of several parts. It includes an element assembly made of a magnetic material, a coil conductor embedded in the element assembly, a connection conductor also located in the element assembly, and an extended conductor that connects the coil conductor to the connection conductor. Additionally, there is an outer electrode on the bottom surface of the element assembly. The coil conductor is connected to the outer electrode through the connection conductor and the extended conductor. The connection conductor extends in one direction from a junction point where it is connected to the extended conductor. The width of the connection conductor is larger than the width of the coil conductor when viewed in that direction.
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| − | '''Abstract'''
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| − | A coil component including an element assembly containing a magnetic material, a coil conductor embedded in the element assembly, a connection conductor disposed in the element assembly, an extended conductor for coupling the coil conductor to the connection conductor, and an outer electrode disposed on a bottom surface of the element assembly. The coil conductor is electrically coupled to the outer electrode with the connection conductor and the extended conductor interposed therebetween. The connection conductor extends from a junction portion connected to the extended conductor in a first direction, and a width of the connection conductor is larger than a width of the coil conductor when viewed in the first direction.
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| | ===ELECTRONIC COMPONENT (18191779)=== | | ===ELECTRONIC COMPONENT (18191779)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Maasa NAKANO | | Maasa NAKANO |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component that consists of an insulator portion with multiple layers of insulation. Inside the insulator, there are several inner conductors in the shape of strips. The component also has two external electrodes that are connected to the inner conductors and face the outer surface of the insulator. The number of inner conductors is between 3 and 5, and they are stacked with insulation layers in between. The total cross-sectional area of the inner conductors ranges from 0.1 mm to 0.5 mm. The abstract also provides specific designations for the thickness, width, and distance between the inner conductors. It states that when there are 3 inner conductors, their dimensions fall within a specific region defined by points A, B, C, D, and E.
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| − | '''Abstract'''
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| − | An electronic component includes an insulator portion in which insulating layers are laminated; inner conductors each having a strip shape and embedded in the insulator portion; and first and second external electrodes which face an outer surface of the insulator portion and are electrically connected to the inner conductors. Also, from 3 to 5 of the inner conductors are provided and the inner conductors being laminated with the insulating layers interposed therebetween, a total sectional area of the inner conductors is from 0.1 mmto 0.5 mm, and when a thickness and a width of the inner conductor are designated as t1 and w4, respectively, a distance between the inner conductors is designated as t2, t1/w4 is designated as x, and t2/t1 is designated as y. When the number of the inner conductors is 3, (x,y) is a region surrounded by A(0.051,1.0), B(0.051,5.9), C(0.2,5.9), D(0.2,4.4), and E(0.1,1.4).
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| | ===ELECTRONIC COMPONENT (18191802)=== | | ===ELECTRONIC COMPONENT (18191802)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Maasa NAKANO | | Maasa NAKANO |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component that consists of an insulator with layers of insulation, embedded inner conductors in a strip shape, and external electrodes. The insulator has upper and lower surfaces, end surfaces, and side surfaces. The inner conductors have two main surfaces, one on the upper side and one on the lower side. They are stacked with insulation layers in between. Each inner conductor has a line portion and extended portions at both ends.
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| − | '''Abstract'''
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| − | An electronic component includes an insulator portion in which insulating layers are laminated; inner conductors each having a strip shape and embedded in the insulator portion; and first and second external electrodes which face an outer surface of the insulator portion and are electrically connected to the inner conductors. The insulator portion has upper and lower surfaces facing each other, first and second end surfaces facing each other, and first and second side surfaces facing each other. Each of the inner conductors has a first main surface which is a main surface on the upper surface side and a second main surface which is a main surface on the lower surface side. The inner conductors are laminated with the insulating layers interposed therebetween. Each inner conductor has a line portion and a first extended portion and a second extended portion located at both ends of the line portion.
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| | ===ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND CIRCUIT MODULE (18330396)=== | | ===ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND CIRCUIT MODULE (18330396)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Hirofumi OIE | | Hirofumi OIE |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component that can be easily designed to improve its performance. This is achieved by increasing the flexibility in arranging the via conductor and internal electrode within the component. The method for manufacturing this component is also explained. The component includes an element body with an outer surface, a via conductor that penetrates part of the element body in the thickness direction, and a columnar electrode that is electrically connected to the via conductor and protrudes from the outer surface. The length of the columnar electrode in the thickness direction is longer than its maximum width in cross section.
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| − | '''Abstract'''
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| − | To provide electronic component that can be easily designed for improving performance of electronic component by increasing a degree of freedom of arrangement of via conductor and internal electrode inside electronic component, method for manufacturing electronic component, and circuit module. Electronic component according to the present disclosure includes element body having outer surface, via conductor configured to penetrate at least a part of element body in a thickness direction of element body, via conductor provided so that one end surface is flush with outer surface of element body, and columnar electrode having base end portion electrically connected to one end surface of via conductor, so as to protrude in thickness direction from outer surface of element body. A length in thickness direction of columnar electrode is longer than maximum width in cross section orthogonal to thickness direction of columnar electrode.
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| | ===MULTILAYER CERAMIC ELECTRONIC COMPONENT (18124015)=== | | ===MULTILAYER CERAMIC ELECTRONIC COMPONENT (18124015)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Yukie WATANABE | | Yukie WATANABE |
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| − | '''Brief explanation'''
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| − | The abstract describes a structure of a multilayer ceramic electronic component. It mentions the presence of two auxiliary electrode layers, which are separated from internal electrode layers and exposed to different end surfaces. These auxiliary electrode layers are located on the same plane as the ceramic layers where the internal electrode layers are positioned. Additionally, there are two via conductors, one for each internal electrode layer and auxiliary electrode layer, located centrally in the width direction and exposed to their respective end surfaces.
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| − | '''Abstract'''
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| − | In a multilayer ceramic electronic component, a first auxiliary electrode layer spaced away from a second internal electrode layer and exposed to a first end surface is on a same plane as a ceramic layer on which the second internal electrode layer is located, a second auxiliary electrode layer spaced away from a first internal electrode layer and exposed to a second end surface is on a same plane as the ceramic layer on which the first internal electrode layer is located, a first via conductor is at a central portion in a width direction of the first internal electrode layer and the first auxiliary electrode layer and exposed to the first end surface, and a second via conductor is at a central portion in a width direction of the second internal electrode layer and the second auxiliary electrode layer and exposed to the second end surface.
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| | ===MULTILAYER CERAMIC CAPACITOR (18109309)=== | | ===MULTILAYER CERAMIC CAPACITOR (18109309)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Natsuko OKUBO | | Natsuko OKUBO |
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| − | '''Brief explanation'''
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| − | The abstract describes a multilayer ceramic capacitor that has a multilayer structure with dielectric layers, internal electrode layers, and external electrodes. The capacitor also has side margin portions made of a dielectric material. The internal electrode layers have a narrower extension electrode portion compared to the counter electrode portion. The side margin portions contain Ba, Ti, and Mg, with the Mg content ranging from 0.2 mol% to 2.0 mol% relative to 100 mol of Ti. The internal electrode layers contain Ni as the main component, and the end portion of the counter electrode portion contains Mg as a sub component. The Mg content in the counter electrode portion ranges from 0.13 mol% to 0.39 mol% relative to 100 mol of Ni.
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| − | '''Abstract'''
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| − | A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, and external electrodes. The multilayer body includes side margin portions made of a dielectric. In the internal electrode layers, a width of an extension electrode portion is smaller than a width of a counter electrode portion. The side margin portions each include Ba and Ti as a main component and Mg as a sub component. The Mg content is about 0.2 mol% or more and about 2.0 mol% or less with respect to 100 mol of Ti. The internal electrode layers each include Ni as a main component, and an end portion of the counter electrode portion includes Mg as a sub component. The Mg content is about 0.13 mol% or more and about 0.39 mol% or less with respect to 100 mol of Ni.
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| | ===THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR (18124606)=== | | ===THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR (18124606)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Yuichiro MORIMOTO | | Yuichiro MORIMOTO |
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| − | '''Brief explanation'''
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| − | The abstract describes a specific type of multilayer ceramic capacitor with three terminals. The capacitor has four external electrodes, each consisting of a base electrode layer made of a conductive metal and a glass component, an organic layer made of an organosilicon compound that covers the base electrode layer, and a plating layer on top of the organic layer.
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| − | The abstract states that on the surface of the organic layer, in the area facing the plating layer, there is a specific atomic concentration ratio of silicon (Si) to copper (Cu). This ratio is either between 1.5% and 5.5%, or between 0.8% and 2.8%. Additionally, the surface roughness of this area falls within a specific range, either between 0.334 and 0.371, or between 0.352 and 0.395.
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| − | Overall, the abstract provides technical details about the composition and characteristics of a specific type of multilayer ceramic capacitor.
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| − | '''Abstract'''
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| − | In a three-terminal multilayer ceramic capacitor, each of first through fourth external electrodes includes a base electrode layer including a conductive metal and a glass component, an organic layer including an organosilicon compound covering the base electrode layer, and a plating layer on the organic layer. On a surface of the organic layer in a portion facing the plating layer, an atomic concentration ratio of Si to Cu is greater than or equal to about 1.5% and less than or equal to about 5.5%, or greater than or equal to about 0.8% and less than or equal to about 2.8%, and a surface roughness is greater than or equal to about 0.334 and less than or equal to about 0.371, or greater than or equal to about 0.352 and less than or equal to about 0.395.
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| | ===ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT (18331589)=== | | ===ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRONIC COMPONENT (18331589)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Naganori HIRAKAWA | | Naganori HIRAKAWA |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component that consists of multiple insulating layers stacked together. On the surface of these layers, there are conductive materials called surface conductors. Additionally, there is an internal conductor located at the boundary between each insulating layer. The surface conductor is thicker than the thinnest insulating layer and the internal conductor.
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| − | '''Abstract'''
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| − | An electronic component includes a plurality of laminated insulating layers, one or more surface conductors formed on a surface of the insulating layer, and an internal conductor formed at a boundary portion between the adjacent insulating layers. A thickness of the surface conductor is larger than a thickness of a thinnest layer of the insulating layers and larger than a thickness of the internal conductor.
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| | ===ELECTRONIC DEVICE (18207700)=== | | ===ELECTRONIC DEVICE (18207700)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Takashi IWAMOTO | | Takashi IWAMOTO |
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| − | '''Brief explanation'''
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| − | This abstract describes an electronic device that consists of three main components: a substrate, a support body, and a conductive film. The substrate is either a piezoelectric substrate or a compound semiconductor substrate, and it has functional elements on its first main surface. The support body is located on the opposite side of the substrate and has a higher thermal conductivity than the substrate. Lastly, there is a conductive film that is positioned in a through hole within the support body and has a higher thermal conductivity than the support body.
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| − | '''Abstract'''
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| − | An electronic device includes a substrate, a support body, and a conductive film. The substrate is a piezoelectric substrate or a compound semiconductor substrate including a first main surface with functional elements. The support body is provided at a second main surface of the substrate opposite to the first main surface and has a higher thermal conductivity than the substrate. The conductive film is located in a through hole extending through the support body and has a higher thermal conductivity than the support body.
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| | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18329078)=== | | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18329078)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Hiroyuki YAMAMOTO | | Hiroyuki YAMAMOTO |
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| − | '''Brief explanation'''
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| − | The present disclosure describes a potential benefit of reducing the amount of solder used for connecting a ground terminal to a ground layer in order to strengthen the ground connection between two RF terminals. This is achieved in a high-frequency module that includes a mounting substrate and a filter. The filter consists of a first RF terminal, a second RF terminal, and a ground terminal. The ground terminal is positioned between the first and second RF terminals in the thickness direction of the mounting substrate. The mounting substrate has a ground layer on one of its surfaces, and the ground terminal is connected to the ground layer through a solder bump. The ground layer also has a through-hole that is in contact with the ground terminal.
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| − | '''Abstract'''
| |
| − | One possible benefit of the present disclosure is to reduce an amount of solder for the connection between a ground terminal and a ground layer to flow out to the ground layer, while strengthening a ground between two RF terminals. A high-frequency module includes a mounting substrate and a filter. The filter includes a first RF terminal, a second RF terminal, and a ground terminal. The ground terminal is located between the first RF terminal and the second RF terminal in plan view in a thickness direction of the mounting substrate. The mounting substrate has a ground layer on a first principal surface. The ground terminal is formed by a solder bump and connected to the ground layer. The ground layer has a through-hole in contact with the ground terminal.
| |
| | | | |
| | ===ELECTRONIC DEVICE (18207170)=== | | ===ELECTRONIC DEVICE (18207170)=== |
| Line 235: |
Line 95: |
| | '''Inventor''' | | '''Inventor''' |
| | Takashi IWAMOTO | | Takashi IWAMOTO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes an electronic device that includes various components such as a substrate, a metal connection body, a support body, a metal body, and a via. The substrate is a special type of material that can generate electricity when pressure is applied or a compound semiconductor material. It has a functional element on one side. The substrate is mounted on a base substrate with the functional element facing it. The metal body is in contact with a support body and extends outside the substrate. A via connects the metal body outside the substrate to the base substrate, and it has a higher ability to conduct heat compared to the substrate.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An electronic device includes a substrate, a base substrate, a metal connection body, a support body, a metal body, and a via. The substrate includes one main surface with a functional element and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that the one main surface faces the base substrate. The metal body is in contact with the support body and includes at least a portion extending to outside the substrate in plan view from the support body. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.
| |
| | | | |
| | ===ELECTRONIC DEVICE (18207699)=== | | ===ELECTRONIC DEVICE (18207699)=== |
| Line 246: |
Line 100: |
| | '''Inventor''' | | '''Inventor''' |
| | Takashi IWAMOTO | | Takashi IWAMOTO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes an electronic device that includes a substrate, a base substrate, a metal connection body, a metal body, and a via. The substrate is a piezoelectric or compound semiconductor substrate and has functional elements on one side. It is mounted on the base substrate with the opposite side facing it. The metal body is located on the substrate and extends outside of it. The via connects the metal body outside the substrate to the base substrate and has a higher thermal conductivity than the substrate.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An electronic device includes a substrate, a base substrate, a metal connection body, a metal body, and a via. The substrate includes a first main surface provided with functional elements and is a piezoelectric substrate or a compound semiconductor substrate. The substrate is mounted on the base substrate such that a second main surface of the substrate opposite to the one main surface faces the base substrate. The metal body is provided at the first main surface of the substrate and includes at least a portion that extends to outside the substrate in plan view from the one main surface. The via connects the portion of the metal body outside the substrate and the base substrate to each other and has a higher thermal conductivity than the substrate.
| |
| | | | |
| | ===SOLID-STATE BATTERY (18332352)=== | | ===SOLID-STATE BATTERY (18332352)=== |
| Line 257: |
Line 105: |
| | '''Inventor''' | | '''Inventor''' |
| | Ryohei TAKANO | | Ryohei TAKANO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a type of battery called a solid-state battery. This battery consists of three main layers: a positive electrode layer, a negative electrode layer, and a solid electrolyte layer in between. The positive electrode layer contains a material that can store and release energy, as well as an oxide with a specific crystal structure called garnet.
| |
| − |
| |
| − | The abstract also mentions two different concentrations of lithium (Li) within the oxide material. The first concentration, found near the interface between the positive electrode material and the oxide, is lower than the second concentration, which is present within the particles of the oxide material.
| |
| − |
| |
| − | In summary, this abstract introduces a solid-state battery design that incorporates a specific type of oxide material and highlights the difference in lithium concentration within the oxide.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A solid-state battery that includes a positive electrode layer, a negative electrode layer, and a solid electrolyte layer between the positive electrode layer and the negative electrode layer, in which the positive electrode layer contains a positive electrode active material and an oxide having a garnet-type crystal structure, and a first Li concentration in an interface vicinity with the positive electrode active material in the oxide is lower than a second Li concentration in a particle interior of the oxide.
| |
| | | | |
| | ===METHOD FOR PREPARING A LITHIUM ION SECONDARY BATTERY AND A LITHIUM ION SECONDARY BATTERY PREPARED THEREFROM (18127073)=== | | ===METHOD FOR PREPARING A LITHIUM ION SECONDARY BATTERY AND A LITHIUM ION SECONDARY BATTERY PREPARED THEREFROM (18127073)=== |
| Line 272: |
Line 110: |
| | '''Inventor''' | | '''Inventor''' |
| | Hao ZHANG | | Hao ZHANG |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The present invention describes a method for preparing a lithium ion secondary battery and the resulting battery itself. The method involves injecting a first electrolyte, which contains a fluorobenzene-based additive, an organic solvent, and a lithium salt, into a battery assembly consisting of a positive electrode, a negative electrode, and a separator. The battery assembly is then subjected to pre-formation. Subsequently, a second electrolyte containing chain fluoroester is injected into the battery assembly. This method and the resulting battery offer improved protection for the electrodes, as well as excellent cycling performance at high temperatures and low post cycle impedance.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | The present invention provides a method for preparing a lithium ion secondary battery and a lithium ion secondary battery prepared therefrom. The method for preparing a lithium ion secondary battery comprises the following steps: step S1, injecting a first electrolyte containing a fluorobenzene-based additive, an organic solvent and a lithium salt into a battery assembly, wherein the battery assembly comprises a positive electrode, a negative electrode and a separator; step S2, subjecting the battery assembly to pre-formation; and step S3, injecting a second electrolyte containing chain fluoroester into the battery assembly. The method for preparing the lithium ion secondary battery and the lithium ion secondary battery prepared therefrom can achieve better protection of electrodes, and excellent cycling performance at high temperatures as well as low post cycle impedance.
| |
| | | | |
| | ===MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR (18207169)=== | | ===MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR (18207169)=== |
| Line 283: |
Line 115: |
| | '''Inventor''' | | '''Inventor''' |
| | Yushi SOETA | | Yushi SOETA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a multilayer body with insulating layers stacked on top of each other. The body has three conductive layers: a first conductive layer on the top surface of one of the insulating layers, a second conductive layer on the same insulating layer as the first conductive layer, and a top conductive layer above the second conductive layer. The first signal is transmitted through the first conductive layer, while the second signal with a higher frequency is transmitted through the second conductive layer. The second conductive layer is thinner than the first conductive layer in the vertical direction.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.
| |
| | | | |
| | ===POWER AMPLIFIER CIRCUIT (18192835)=== | | ===POWER AMPLIFIER CIRCUIT (18192835)=== |
| Line 294: |
Line 120: |
| | '''Inventor''' | | '''Inventor''' |
| | Yuri HONDA | | Yuri HONDA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a power amplifier circuit that consists of several components. The first component is a first amplifier that takes a first voltage from a voltage supply source and uses it to amplify a first signal, producing an amplification signal as output. The second component is a bias transistor, which has a base or gate that receives a bias control current and an emitter or source that supplies a bias to the first amplifier through a resistor element. The third component is a protection circuit, which diverts a portion of the bias control current to the ground based on the amplification signal and a second signal derived from the first voltage.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A power amplifier circuit includes a first amplifier that operates in accordance with a first voltage supplied from a voltage supply source, amplifies a first signal, and outputs an amplification signal, a bias transistor that includes a base or a gate to which a bias control current is supplied and an emitter or a source supplying a bias to the first amplifier through a first resistor element, and a protection circuit that causes part of the bias control current to flow to a ground on the basis of the amplification signal and a second signal based on the first voltage.
| |
| | | | |
| | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18331534)=== | | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18331534)=== |
| Line 305: |
Line 125: |
| | '''Inventor''' | | '''Inventor''' |
| | Yukiya YAMAGUCHI | | Yukiya YAMAGUCHI |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a high-frequency module that consists of a module substrate with two major surfaces facing each other. The module also includes multiple post electrodes and a power amplification component. The power amplification component is made up of a base material with two major surfaces, an amplification transistor on one side of the base material, and a metal electrode connected to the transistor.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplification transistor formed on a side of the major surface of the base material; and a metal electrode placed on the major surface and connected to the amplification transistor.
| |
| | | | |
| | ===POWER AMPLIFIER (18328653)=== | | ===POWER AMPLIFIER (18328653)=== |
| Line 316: |
Line 130: |
| | '''Inventor''' | | '''Inventor''' |
| | Shigeki KOYA | | Shigeki KOYA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a power amplifier that consists of multiple stages, each stage containing a bipolar transistor and a base electrode. The bipolar transistor in each stage has a collector layer, a base layer on top of the collector layer, and an emitter mesa on a part of the base layer. The emitter mesa is elongated in one direction when viewed from above. The base electrode has a main portion that is separated from the emitter mesa by a gap in a direction perpendicular to the elongated direction of the emitter mesa. The main portion of the base electrode is elongated in the same direction as the emitter mesa and is connected to the base layer electrically.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A power amplifier comprising amplifier circuits of multiple stages. Each of the amplifier circuits of multiple stages includes a bipolar transistor and a base electrode. The bipolar transistor included in each of the amplifier circuits of multiple stages includes a collector layer, a base layer placed on the collector layer, and an emitter mesa placed on part of the region of the base layer. The emitter mesa has a shape elongated in one direction in plan view. The base electrode includes a base main portion arranged in such a manner as to be separated from the emitter mesa with a gap in a direction orthogonal to a lengthwise direction of the emitter mesa in plan view. The base main portion has a shape elongated in a direction parallel to the lengthwise direction of the emitter mesa in plan view and is electrically connected to the base layer.
| |
| | | | |
| | ===POWER AMPLIFIER CIRCUIT (18192213)=== | | ===POWER AMPLIFIER CIRCUIT (18192213)=== |
| Line 327: |
Line 135: |
| | '''Inventor''' | | '''Inventor''' |
| | Kenichi SHIMAMOTO | | Kenichi SHIMAMOTO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a power amplifier circuit that consists of two amplifier transistors. The first transistor receives a balanced signal as input and outputs an amplified signal. The second transistor also receives a balanced signal as input and outputs an amplified signal. Both transistors are connected to the ground through their emitters or sources. The circuit also includes two variable capacitances that are connected between the collector or drain of one transistor and the base or gate of the other transistor.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A power amplifier circuit includes a first amplifier transistor having a base or gate for receiving a first signal inputted, the first signal being one balanced signal, a collector or drain for outputting a first amplified signal, and an emitter or source that is electrically connected to ground, a second amplifier transistor having a base or gate for receiving a second signal inputted, the second signal being another balanced signal, a collector or drain for outputting a second amplified signal, and an emitter or source that is electrically connected to the ground, a first variable capacitance electrically coupled between the collector or drain of the second amplifier transistor and the base or gate of the first amplifier transistor, and a second variable capacitance electrically coupled between the collector or drain of the first amplifier transistor and the base or gate of the second amplifier transistor.
| |
| | | | |
| | ===COMBINER CIRCUIT (18192802)=== | | ===COMBINER CIRCUIT (18192802)=== |
| Line 338: |
Line 140: |
| | '''Inventor''' | | '''Inventor''' |
| | Yuuki TANAKA | | Yuuki TANAKA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a combiner circuit that combines two signals, one from a carrier amplifier circuit and the other from a peak amplifier circuit. These signals are generated by amplifying distribution signals from an input signal. The combiner circuit includes a matching section that matches the impedance between the combiner section and a load. The abstract also mentions that the variation coefficient of the imaginary part of impedance associated with an increase in frequency of the input signal is negative.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A combiner circuit includes: a combiner section that outputs a combined signal by combining a first signal output from a carrier amplifier circuit and a second signal output from a peak amplifier circuit, the first signal being generated by amplifying a first distribution signal distributed from an input signal, the second signal being generated by amplifying a second distribution signal distributed from the input signal; and a matching section connected in series with the combiner section to receive the combined signal, wherein a variation coefficient of an imaginary part of impedance associated with an increase in frequency of the input signal indicates a negative value, and the matching section matches impedance between the combiner section and a load.
| |
| | | | |
| | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18330811)=== | | ===HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE (18330811)=== |
| Line 349: |
Line 145: |
| | '''Inventor''' | | '''Inventor''' |
| | Yukiya YAMAGUCHI | | Yukiya YAMAGUCHI |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a high-frequency module that consists of a module substrate with two major surfaces, a resin member that covers part of one major surface, a shield electrode layer that covers part of the resin member's surface, multiple post electrodes on the major surface, and a power amplification component on the major surface. The power amplification component includes a base material with two major surfaces and an amplification transistor on it. The first metal electrode, which is in contact with the shield electrode layer, is placed on one of the major surfaces of the base material.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A high-frequency module includes: a module substrate that has major surfaces that face each other; a resin member for covering at least a part of the major surface; a shield electrode layer for covering at least a part of a surface of the resin member; a plurality of post electrodes placed on the major surface; a power amplification component placed on the major surface; and a first metal electrode (for example, a shield electrode layer). The power amplification component includes: a base material that has major surfaces that face each other, the major surface being located between the major surface and the major surface; and an amplification transistor formed on the base material. The first metal electrode is placed on the major surface and is in contact with the shield electrode layer.
| |
| | | | |
| | ===RADIO-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE (18116984)=== | | ===RADIO-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE (18116984)=== |
| Line 360: |
Line 150: |
| | '''Inventor''' | | '''Inventor''' |
| | Masanori KATO | | Masanori KATO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | This abstract describes a radio-frequency circuit that consists of several components. It includes a switch, four filters, and multiple terminals. The switch can connect either the first or second selection terminal to a common terminal. The first and second filters are connected to the first selection terminal, while the third and fourth filters are connected to the second selection terminal. The first and third filters are band pass filters, while the second filter is a band elimination filter. The pass band of the first filter overlaps with the rejection band of the second filter, and the pass band of the first filter also overlaps with the pass band of the third filter.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A radio-frequency circuit includes a first switch, a first filter, a second filter, a third filter, and a fourth filter. The first switch is capable of selectively connecting a first selection terminal or a second selection terminal to a first common terminal. The first filter and the second filter are connected to the first selection terminal. The third filter and the fourth filter are connected to the second selection terminal. The first filter and the third filter are band pass filters. The second filter is a band elimination filter. A pass band of the first filter and a rejection band of the second filter overlap each other. The pass band of the first filter and a pass band of the third filter overlap each other.
| |
| | | | |
| | ===RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18124634)=== | | ===RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18124634)=== |
| Line 371: |
Line 155: |
| | '''Inventor''' | | '''Inventor''' |
| | Syunsuke KIDO | | Syunsuke KIDO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a radio frequency module that consists of several components including switches, filters, a control circuit, and an antenna terminal. The first switch can connect either a first or second selection terminal to a common terminal, while the second switch can connect either a third or fourth selection terminal to another common terminal. These switches, along with the control circuit, are all part of a single electronic component. The control circuit is positioned between the first and second switches within this component.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A radio frequency module includes a first switch, a second switch, a control circuit, a first filter, a second filter, a third filter, a fourth filter, and an antenna terminal. The first switch is capable of connecting a first selection terminal or a second selection terminal to a first common terminal in a selective manner. The second switch is capable of connecting a third selection terminal or a fourth selection terminal to a second common terminal in a selective manner. The first switch, the second switch, and the control circuit are provided in a single electronic component (a first electronic component). The control circuit is positioned between the first switch and the second switch in the electronic component.
| |
| | | | |
| | ===ACOUSTIC WAVE DEVICE (18206642)=== | | ===ACOUSTIC WAVE DEVICE (18206642)=== |
| Line 382: |
Line 160: |
| | '''Inventor''' | | '''Inventor''' |
| | Minefumi OUCHI | | Minefumi OUCHI |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes an acoustic wave device that includes a support and a piezoelectric layer. The device also has two IDT (interdigital transducer) electrodes, one on each side of the piezoelectric layer. The IDT electrodes have electrode fingers that are not overlapping in plan view. The thickness of the piezoelectric layer (d) and the center-to-center distance between adjacent electrode fingers (p) are such that d/p is 0.5 or less for both IDT electrodes. An insulating film is present on one side of the piezoelectric layer, overlapping the first IDT electrode. A wiring electrode is connected to the second IDT electrode and extends along the insulating film, overlapping the first IDT electrode.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | An acoustic wave device includes a support, a piezoelectric layer including a first principal surface adjacent to the support and a second principal surface, a first IDT electrode on the first principal surface and including first and second electrode fingers, and a second IDT electrode on the second principal surface not overlapping the first IDT electrode in plan view and including first and second electrode fingers. When d is a thickness of piezoelectric layer and p is a center-to-center distance between adjacent ones of the electrode fingers, d/p is about 0.5 or less in the first and second IDT electrodes. An insulating film is provided on the second principal surface overlapping the first IDT electrode in plan view, and a wiring electrode extending along the insulating film overlapping the first IDT electrode in plan view, the wiring electrode being connected to the second IDT electrode.
| |
| | | | |
| | ===TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH REDUCED SPURIOUS MODES (18330409)=== | | ===TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH REDUCED SPURIOUS MODES (18330409)=== |
| Line 393: |
Line 165: |
| | '''Inventor''' | | '''Inventor''' |
| | Soumya Yandrapalli | | Soumya Yandrapalli |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes the invention of acoustic filters and resonators, as well as methods for making them. The acoustic resonator device consists of a substrate, a piezoelectric plate attached to the substrate, and a diaphragm formed by a portion of the piezoelectric plate that spans a cavity in the substrate. On the front surface of the piezoelectric plate, there is a conductor pattern that includes an interdigital transducer (IDTs) with interleaved fingers on the diaphragm. The ratio of the mark (width) of the interleaved fingers to the pitch (spacing) of the fingers is specified to be between 0.2 and 0.3.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | Acoustic filters, resonators and methods of making acoustic filters are disclosed. An acoustic resonator device includes a substrate. A back surface of a piezoelectric plate is attached to the substrate, a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern including an interdigital transducer (IDTs) with interleaved fingers of the IDT disposed on the diaphragm. A ratio of the mark of the interleaved fingers to the pitch of the interleaved fingers is greater than or equal to 0.2 and less than or equal to 0.3.
| |
| | | | |
| | ===COMPOSITE FILTER DEVICE (18207172)=== | | ===COMPOSITE FILTER DEVICE (18207172)=== |
| Line 404: |
Line 170: |
| | '''Inventor''' | | '''Inventor''' |
| | Koji MIYAMOTO | | Koji MIYAMOTO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a composite filter device that consists of a ladder filter and at least one bandpass filter. The ladder filter includes serial arm resonators and parallel arm resonators. The first serial arm resonator and the first parallel arm resonator are the closest ones to a common terminal. The abstract also mentions three expressions (Expression 1, Expression 2, and Expression 3) that need to be satisfied. These expressions involve the duty of the IDT (Interdigital Transducer) of the first serial arm resonator (Sa), the duty of the IDT of the first parallel arm resonator (Pa), and the duty of the IDT of other serial arm resonators and parallel arm resonators (Ta).
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A composite filter device includes a ladder filter and at least one bandpass filter including one end connected in common to the ladder filter, the ladder filter including at least one serial arm resonator including a first serial arm resonator and at least one parallel arm resonator including a first parallel arm resonator. The first serial arm resonator is the closest serial arm resonator to a common terminal, and the first parallel arm resonator is the closest parallel arm resonator to the common terminal. Expression (1), Expression (2), or Expression (3) is satisfied, where a duty of an IDT of the first serial arm resonator is Sa, a duty of an IDT of the first parallel arm resonator is Pa, and a duty of an IDT of each of serial arm resonators other than the first serial arm resonator and of parallel arm resonators other than the first parallel arm resonator is Ta:
| |
| | | | |
| | ===FILTER DEVICE (18207195)=== | | ===FILTER DEVICE (18207195)=== |
| Line 415: |
Line 175: |
| | '''Inventor''' | | '''Inventor''' |
| | Yoshinori KAMEOKA | | Yoshinori KAMEOKA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a filter device that has two paths and a capacitor. The first path includes a ladder filter circuit, which is a type of electronic filter, and connects two terminals. The ladder filter circuit includes a parallel arm resonator that is connected to a ground terminal. The second path includes a grounded resonator and is connected in parallel with the ladder filter circuit. A capacitor is connected to the second path, with one end connected to the second path and the other end connected to a third path. The third path connects the parallel arm resonator and the ground terminal.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A filter device includes a first path, a second path, and a capacitor. The first path includes at least one ladder filter circuit and connects a first terminal and a second terminal. The at least one ladder filter circuit includes a parallel arm resonator connected to a ground terminal. The second path includes a grounded resonator and is connected in parallel with any of the at least one ladder filter circuit. One end of the capacitor is connected to the second path, and the other end of the capacitor is connected to a third path which connects the parallel arm resonator and the ground terminal.
| |
| | | | |
| | ===HYBRID FILTER, MULTIPLEXER, RADIO-FREQUENCY MODULE, AND COMMUNICATION DEVICE (18329607)=== | | ===HYBRID FILTER, MULTIPLEXER, RADIO-FREQUENCY MODULE, AND COMMUNICATION DEVICE (18329607)=== |
| Line 426: |
Line 180: |
| | '''Inventor''' | | '''Inventor''' |
| | Syunsuke KIDO | | Syunsuke KIDO |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a hybrid filter that consists of a module substrate with acoustic wave resonator elements, inductors, and a capacitor. The filter has a wider pass band compared to the resonance band width of the acoustic wave resonator elements. The elements are divided into two circuit elements, each placed on the major surface of the module substrate.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.
| |
| | | | |
| | ===SWITCHING CIRCUIT AND FRONT END CIRCUIT (18192819)=== | | ===SWITCHING CIRCUIT AND FRONT END CIRCUIT (18192819)=== |
| Line 437: |
Line 185: |
| | '''Inventor''' | | '''Inventor''' |
| | Risa TAKEDA | | Risa TAKEDA |
| − |
| |
| − | '''Brief explanation'''
| |
| − | The abstract describes a switching circuit that consists of two antenna terminals, two input-output terminals, multiple switches, and a ground switch. The circuit allows for the electrical connection to be switched between the first antenna terminal and the first input-output terminal. This is achieved by activating the first path switch, which connects the first antenna terminal and the first input-output terminal, and the second path switch and ground switch, which connect the second input-output terminal and the ground. The third path switch, which connects the first path and the second path, remains in a non-conducting state. Overall, this circuit provides a simplified and efficient way to switch the electrical connection between different terminals.
| |
| − |
| |
| − | '''Abstract'''
| |
| − | A switching circuit includes a first antenna terminal and a second antenna terminal, a first input-output terminal and a second input-output terminal, a plurality of switches and a ground switch. When an electrical connection destination of the first input-output terminal is switched to the first antenna terminal, a first path switch included in the plurality of switches and provided along a first path connecting the first input-output terminal and the first antenna terminal to each other, and a second path switch and the ground switch provided along a second path connecting the second input-output terminal and the ground to each other, the second path switch included in the plurality of switches, are in conducting states, and a third path switch included in the plurality of switches and provided along a third path connecting the first path and the second path to each other is in a non-conducting state.
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| | | | |
| | ===RADIO FREQUENCY CIRCUIT AND COMMUNICATION DEVICE (18331954)=== | | ===RADIO FREQUENCY CIRCUIT AND COMMUNICATION DEVICE (18331954)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Takanori UEJIMA | | Takanori UEJIMA |
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| − | '''Brief explanation'''
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| − | This abstract describes a radio frequency circuit that consists of various components such as transmit filters, power amplifiers, and switch circuits. The transmit filters are connected to the power amplifiers, and the switch circuits have different terminals. The terminals are connected to the common terminal and the transmit filters. The switch circuits have different stack numbers, with one having a smaller stack number than the other.
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| − | '''Abstract'''
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| − | A radio frequency circuit includes a transmit filter for B66-Tx connected to a power amplifier, a transmit filter for B25-Tx connected to a power amplifier, a switch circuit having terminals, a switch circuit having a common terminal and terminals, and a switch circuit having a common terminal and terminals. The terminal is connected to the common terminal, the terminal is connected to the common terminal, the terminal is connected to the transmit filter, and the terminal is connected to the transmit filter. The switch circuit has a smaller stack number than the switch circuit, and the switch circuit has a smaller stack number than the switch circuit.
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| | ===CIRCUIT MODULE (18328323)=== | | ===CIRCUIT MODULE (18328323)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Ryota SATO | | Ryota SATO |
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| − | '''Brief explanation'''
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| − | The abstract describes a circuit module that is designed to shield electromagnetic waves from both the sides and the bottom of an electronic component. The circuit module consists of a main board, a first electronic component mounted on the main board, and a submodule also mounted on the main board. The submodule includes a sub board, which has a bottom plate mounted on the main board and a side plate extending upward from the bottom plate. A second electronic component is mounted on the upper surface of the bottom plate. The sub board is designed with shield patterns on the lower surface of the bottom plate and the outer side surface of the side plate to provide electromagnetic wave shielding.
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| − | '''Abstract'''
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| − | To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.
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| | ===CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD (18204978)=== | | ===CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD (18204978)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Kosuke NISHIO | | Kosuke NISHIO |
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| − | '''Brief explanation'''
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| − | The abstract describes a circuit board that has multiple layers of insulating material and layers of conductive material. Specifically, there are two conductor layers that are aligned in a perpendicular direction on one of the insulator layers. The distance between these conductor layers is called the proximity distance. The closest pair of conductor layers, with the smallest proximity distance, are located on the top surface of the first insulator layer.
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| − | '''Abstract'''
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| − | A circuit board includes one or more insulator layers, and upper and lower principal surfaces, and conductor layers in or on the substrate body. The conductor layers include a pair of first and second conductor layers on one of the insulator layers. Each of the pairs of the first and second conductor layers includes a first proximity section in which the first and second conductor layers are aligned in an orthogonal direction to an extending direction of the first conductor layer. A distance between the first and second conductor layers in the first proximity section is defined as a proximity distance. Most proximate first and second conductor layers are defined as the first and second conductor layers with a smallest proximity distance and are located on an upper principal surface of a first insulator layer of the one or more insulating layers.
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| | ===RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18307153)=== | | ===RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18307153)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Kunitoshi HANAOKA | | Kunitoshi HANAOKA |
| − |
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| − | '''Brief explanation'''
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| − | This abstract describes a radio frequency module that is designed to improve isolation between multiple electronic components. The module includes a mounting substrate, two electronic components, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is placed between the two electronic components on the mounting substrate. The first metal layer is located on the mounting substrate and is in contact with the second metal layer. The second metal layer covers part of the resin layer. The first metal layer has a ground potential and is connected to the metal member and the second metal layer.
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| − | '''Abstract'''
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| − | To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.
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| | ===RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE (18332251)=== | | ===RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE (18332251)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Tetsuro HARADA | | Tetsuro HARADA |
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| − | '''Brief explanation'''
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| − | The abstract describes a radio-frequency module that has been designed to improve detection accuracy while reducing its size. The module includes an antenna terminal, signal input and output terminals, a mounting substrate, a chip inductor, and a directional coupler. The chip inductor is mounted on one side of the mounting substrate and is used in either the transmitting path or the receiving path between the antenna terminal and the signal input/output terminals. The directional coupler is mounted on the other side of the substrate and is partially used in the transmitting path.
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| − | '''Abstract'''
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| − | Detection accuracy is improved with a reduced size. A radio-frequency module includes an antenna terminal, a signal input terminal, a signal output terminal, a mounting substrate, a chip inductor, and a directional coupler. The mounting substrate has a first major surface and a second major surface opposite to each other. The chip inductor is mounted on the first major surface of the mounting substrate. The chip inductor is provided in at least one of a transmitting path between the antenna terminal and the signal input terminal and a receiving path between the antenna terminal and the signal output terminal. The directional coupler is mounted on the second major surface of the mounting substrate, and at least part of the directional coupler is provided in the transmitting path.
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| | ===ELECTRONIC COMPONENT PACKAGE (18118178)=== | | ===ELECTRONIC COMPONENT PACKAGE (18118178)=== |
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| | '''Inventor''' | | '''Inventor''' |
| | Tomofumi KOBAYASHI | | Tomofumi KOBAYASHI |
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| − | '''Brief explanation'''
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| − | The abstract describes an electronic component package that consists of a base tape with recesses. Inside each recess, there is a protrusion that can come into contact with an electronic component placed inside the recess. The electronic component itself is a multilayer body with a shape similar to a rectangular box, and it has external electrodes on both of its end surfaces.
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| − | '''Abstract'''
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| − | An electronic component package includes a base tape including recesses. On an inner surface of each of the recesses, a protrusion that can abut an electronic component inside of the recess is provided. The electronic component includes a multilayer body having a parallelepiped or substantially parallelepiped shape and an external electrode on each of two end surfaces of the multilayer body.
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