Mitsubishi electric corporation (20240136309). SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
mitsubishi electric corporation
Inventor(s)
Junichi Yamashita of Tokyo (JP)
Tomohide Terashima of Tokyo (JP)
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136309 titled 'SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application aims to improve reliability and extend the lifespan of the device while also keeping production costs in check. This is achieved through the use of a conductive metal plate containing copper as the main component, which is solid-state diffusion bonded to the top electrode of the semiconductor element.
- Semiconductor device with enhanced reliability and longer lifespan
- Top electrode on the semiconductor element
- Conductive metal plate with copper as the main component
- Solid-state diffusion bonding to the top electrode
Potential Applications
The technology could be applied in various electronic devices such as power modules, inverters, and other semiconductor-based systems where reliability and longevity are crucial.
Problems Solved
1. Increased reliability and longer lifespan of semiconductor devices 2. Cost-effective production without compromising quality
Benefits
1. Improved device performance and durability 2. Cost savings in production 3. Enhanced overall efficiency of electronic systems
Potential Commercial Applications
Optimizing Semiconductor Devices for Longevity and Reliability
Possible Prior Art
There may be prior art related to the use of copper in semiconductor devices or solid-state diffusion bonding techniques, but further research is needed to identify specific examples.
Unanswered Questions
How does the technology impact the overall efficiency of electronic systems?
The technology improves the reliability and lifespan of semiconductor devices, leading to more stable and consistent performance over time. This can result in fewer system failures and downtime, ultimately increasing the efficiency of electronic systems.
What are the specific cost savings associated with the production of these semiconductor devices?
By utilizing a conductive metal plate with copper as the main component and solid-state diffusion bonding, the production costs can be kept in check without sacrificing quality. This can lead to significant savings in manufacturing expenses while still delivering a high-quality product.
Original Abstract Submitted
provided is a semiconductor device with higher reliability and longer life which can suppress an increase in production costs. a semiconductor device includes: a semiconductor element; a top electrode on an upper surface of the semiconductor element; and a conductive metal plate containing copper as a main component and solid-state diffusion bonded to the top electrode of the semiconductor element.
