View source for Micron technology, inc. (20240128163). SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract

=SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS=


==Organization Name==

[[:Category:micron technology, inc.|micron technology, inc.]]


[[Category:micron technology, inc.]]

==Inventor(s)==

[[:Category:Hong Wan Ng of Singapore (SG)|Hong Wan Ng of Singapore (SG)]][[Category:Hong Wan Ng of Singapore (SG)]]

[[:Category:Chin Hui Chong of Singapore (SG)|Chin Hui Chong of Singapore (SG)]][[Category:Chin Hui Chong of Singapore (SG)]]

[[:Category:Hem P. Takiar of Fremont CA (US)|Hem P. Takiar of Fremont CA (US)]][[Category:Hem P. Takiar of Fremont CA (US)]]

[[:Category:Seng Kim Ye of Singapore (SG)|Seng Kim Ye of Singapore (SG)]][[Category:Seng Kim Ye of Singapore (SG)]]

[[:Category:Kelvin Tan Aik Boo of Singapore (SG)|Kelvin Tan Aik Boo of Singapore (SG)]][[Category:Kelvin Tan Aik Boo of Singapore (SG)]]

==SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240128163 titled 'SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS

==Simplified Explanation==

The patent application describes substrates for semiconductor packages, including hybrid substrates for decoupling capacitors. Here are some key points from the abstract:

* Substrates include a first pair and a second pair of electrical contacts on a first surface.
* The first pair of contacts is for a first surface-mount capacitor, and the second pair is for a second surface-mount capacitor.
* The pairs of contacts are spaced apart by specific distances corresponding to the capacitors.

== Potential Applications ==
The technology described in the patent application could be applied in various semiconductor packaging applications where decoupling capacitors are needed to improve performance and reduce noise.

== Problems Solved ==
This technology solves the problem of efficiently integrating decoupling capacitors into semiconductor packages, providing a more compact and effective solution compared to traditional methods.

== Benefits ==
The benefits of this technology include improved performance, reduced noise, space-saving design, and potentially lower manufacturing costs.

== Potential Commercial Applications ==
One potential commercial application of this technology could be in the production of high-performance electronic devices such as smartphones, tablets, and other consumer electronics.

== Possible Prior Art ==
One possible prior art could be the use of traditional decoupling capacitor integration methods in semiconductor packages.

=== Unanswered Questions ===

=== How does this technology compare to existing methods of integrating decoupling capacitors in semiconductor packages? ===
This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.

=== What specific manufacturing processes are required to implement this technology in semiconductor packages? ===
The article does not delve into the details of the manufacturing processes involved, leaving a gap in understanding for readers interested in the practical implementation of this innovation.


==Original Abstract Submitted==

substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. in one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. the first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. the first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. the first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.



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