Micron Technology, Inc. patent applications published on April 11th, 2024

Summary of the patent applications from Micron Technology, Inc. on April 11th, 2024

Micron Technology, Inc. has recently filed patents for innovative technologies in the field of semiconductor manufacturing and memory storage devices. These patents describe methods for integrated assemblies, error detection and classification, wafer-level packaging of solid-state transducers, and semiconductor interposers with multiple redistribution structures.

Summary in bullet points:

• Integrated assembly with container-shaped structures and storage elements.
• Error detection and classification method for host devices communicating with memory devices.
• Wafer-level packaging method for solid-state transducers with discrete optical elements.
• Semiconductor interposer with multiple redistribution structures and circuit elements.

Notable applications:

• Semiconductor manufacturing
• Memory storage devices
• Data storage systems
• Communication systems
• Medical devices
• High-performance computing systems
• Advanced communication devices
• Automotive electronics

Patent applications for Micron Technology, Inc. on April 11th, 2024

DYNAMIC ADAPTATION OF AUTOMOTIVE AI PROCESSING POWER AND ACTIVE SENSOR DATA (18495642)

Main Inventor

Gil Golov

A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY (17962927)

Main Inventor

Kaleb A. Wilson

DIE FAMILY MANAGEMENT ON A MEMORY DEVICE USING BLOCK FAMILY ERROR AVOIDANCE (18543170)

Main Inventor

Steven Michael Kientz

MASTER SLAVE MANAGED MEMORY STORAGE (18491685)

Main Inventor

Gil Golov

Message Routing in a Network-Ready Storage Product for Internal and External Processing (18544806)

Main Inventor

Luca Bert

ERROR DETECTION AND CLASSIFICATION AT A MEMORY DEVICE (17938898)

Main Inventor

Aaron P. Boehm

TEMPORARY PARITY BUFFER ALLOCATION FOR ZONES IN A PARITY GROUP (18483091)

Main Inventor

Kishore Kumar Muchherla

SECURE FIRMWARE UPDATE THROUGH A PREDEFINED SERVER (18542440)

Main Inventor

Zhan Liu

THREE-STATE PROGRAMMING OF MEMORY CELLS (18545245)

Main Inventor

Hernan A. Castro

ENHANCED GRADIENT SEEDING SCHEME DURING A PROGRAM OPERATION IN A MEMORY SUB-SYSTEM (18545888)

Main Inventor

Vinh Q. Diep

MULTI-SAMPLED, CHARGE-SHARING THERMOMETER IN MEMORY DEVICE (18539798)

Main Inventor

Agostino Macerola

INTERPOSERS FOR MICROELECTRONIC DEVICES (18381061)

Main Inventor

Owen Fay

WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS (18536073)

Main Inventor

Vladimir Odnoblyudov

ERROR DETECTION AND CLASSIFICATION AT A HOST DEVICE (17961805)

Main Inventor

Aaron P. Boehm

Integrated Assemblies and Methods of Forming Integrated Assemblies (18545180)

Main Inventor

David K. Hwang