Meta platforms technologies, llc (20240126217). FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES simplified abstract
Contents
- 1 FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES
Organization Name
meta platforms technologies, llc
Inventor(s)
Michael Tawfik Khbeis of Federal Way WA (US)
Shantonu Biswas of Lynnwood WA (US)
Lichuan Chen of Bellevue WA (US)
Omar Awartani of Redmond WA (US)
Benjamin Cook of Woodinville WA (US)
Amirhossein Hajiagha Memar of Woodinville WA (US)
FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240126217 titled 'FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES
Simplified Explanation
The flexible electronic system described in the patent application comprises a flexible substrate with an interlayer elastomer dielectric and rigid components, along with a high-density interconnect region and a flexible barrier material encapsulating the system. The system also includes routing layers and through-vias to connect components and routing layers.
- Flexible electronic system with flexible substrate and rigid components
- High-density interconnect region with routing layers and through-vias
- Flexible barrier material encapsulating the system
- Through-vias connecting components and routing layers
- Some routing layers have conductive traces
Potential Applications
The technology could be used in flexible electronics, wearable devices, medical devices, and IoT applications.
Problems Solved
The technology solves the problem of integrating rigid components into flexible electronic systems while maintaining flexibility and durability.
Benefits
The benefits of this technology include increased flexibility, durability, and functionality in electronic systems.
Potential Commercial Applications
Potential commercial applications include flexible displays, smart clothing, medical sensors, and flexible circuit boards.
Possible Prior Art
One possible prior art could be the development of flexible electronic systems with rigid components and high-density interconnect regions.
Unanswered Questions
1. How does the flexible barrier material impact the overall performance of the electronic system? 2. Are there any limitations to the number of routing layers and through-vias that can be incorporated into the system?
Original Abstract Submitted
a flexible electronic system comprises a flexible substrate comprising an interlayer elastomer dielectric and a plurality of rigid components disposed within the flexible substrate. the flexible electronic system may further comprise a high-density interconnect region comprising one or more routing layers. in examples, the flexible electronic system may further comprise a flexible barrier material encapsulating the flexible electronic system. in some examples the flexible electronic system and the high-density interconnect region may further comprise a plurality of routing layers and one or more through-vias. each through-via may couple at least one of two rigid components, two routing layers, or a rigid component and a routing layer. in examples, at least some of the routing layers may comprise conductive traces.
