METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE: abstract simplified (18146283)

• This abstract for appeared for patent application number 18146283 Titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE'

Simplified Explanation

This abstract describes a coating process using a nozzle to apply a coating liquid onto a structure that includes a semiconductor element and a wire bonded to the element. The nozzle is designed to generate a spiral liquid transport wind, which directs the coating liquid towards the structure. After the coating is applied, a drying process is performed to create a primary layer around the wire, which contains a silane coupling agent.

Original Abstract Submitted

A coating process of a coating liquid using a nozzle is performed on a coating target structure including a semiconductor element and a wire bonded to the semiconductor element by a wire bonding process. The nozzle has a transport wind generating function of generating a liquid transport wind in a spiral manner. Thus, the coating liquid discharged from the coating liquid supply port of the nozzle is supplied to the coating target structure along the directivity of the liquid transport wind. Then, a drying process is performed on the coating target structure to form a primary layer containing a silane coupling agent as a constituent material on an outer periphery of the wire.