METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT: abstract simplified (18210137)

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  • This abstract for appeared for patent application number 18210137 Titled 'METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT'

Simplified Explanation

This abstract describes a method for manufacturing a ceramic electronic component. The process involves several steps, including producing ceramic chip element assemblies, preparing a jig with chip storing portions, storing the ceramic chip element assemblies in the chip storing portions, working on the chip element assemblies, and finally removing them from the chip storing portions. The method aims to simplify the manufacturing process of ceramic electronic components.


Original Abstract Submitted

A method for manufacturing a ceramic electronic component includes a ceramic chip element assembly production step of producing ceramic chip element assemblies, a jig preparation step of preparing a jig with chip storing portions including a bottom portion to support a ceramic chip element assembly from below and an open-top side wall portion, a ceramic chip element assembly storing step of storing the ceramic chip element assemblies in the chip storing portions in a one-to-one correspondence, a ceramic chip element assembly working step of working the ceramic chip element assemblies stored in the chip storing portions, and a ceramic chip element assembly removal step of removing the ceramic chip element assemblies from the chip storing portions.

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