METHOD FOR CONNECTING A FILM TO A SUBSTRATE: abstract simplified (18296483)

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  • This abstract for appeared for patent application number 18296483 Titled 'METHOD FOR CONNECTING A FILM TO A SUBSTRATE'

Simplified Explanation

This abstract describes a method for connecting a film to a substrate. The method involves bringing the film and substrate together and applying a clamping force in a specific region to establish contact between the two. The film and substrate are then heated in a connecting region to bond them together. Despite the clamping force being maintained during the heating process, the film and substrate can still be moved relative to each other in the clamping region.


Original Abstract Submitted

A method for connecting a film () to a substrate () includes providing () a film () and a substrate (), bringing () the film () and the substrate () together, applying () at least one clamping force in at least one clamping region (), in which the clamping force acts to establish a contact of the film () with the substrate (), and heating () the film () and/or substrate () in at least a respective connecting region () in which the film () and the substrate () are connected together. The clamping force is maintained during the heating process, yet the film () and the substrate () can be moved relative to one another in the clamping region ().

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