Lg electronics inc. (20240120141). COIL SUBSTRATE simplified abstract

From WikiPatents
Jump to navigation Jump to search

COIL SUBSTRATE

Organization Name

lg electronics inc.

Inventor(s)

Byeong Geuk Kang of Seoul (KR)

Younseok Jang of Seoul (KR)

COIL SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120141 titled 'COIL SUBSTRATE

Simplified Explanation

The present specification describes a coil substrate with a unique design featuring a greater number of patterns in the innermost turn compared to the outermost turn.

  • The coil substrate comprises a substrate and a coil mounted on one surface of the substrate.
  • The coil consists of a plurality of turns, including a first inner turn and a first outer turn.
  • The first inner turn has a greater number of patterns than the first outer turn.

Potential Applications

This technology could be applied in:

  • Electronics manufacturing
  • Wireless charging systems
  • Inductive sensors

Problems Solved

This innovation addresses issues such as:

  • Improving coil efficiency
  • Enhancing magnetic field strength
  • Increasing signal transmission reliability

Benefits

The benefits of this technology include:

  • Higher performance in electronic devices
  • Improved energy transfer efficiency
  • Enhanced sensitivity in sensor applications

Potential Commercial Applications

Potential commercial applications for this technology include:

  • Consumer electronics
  • Automotive industry (e.g., inductive charging systems)
  • Medical devices (e.g., MRI machines)

Possible Prior Art

There is no known prior art related to this specific design of a coil substrate.

Unanswered Questions

How does the number of patterns in the innermost turn affect the overall performance of the coil substrate?

The abstract does not provide specific details on the impact of the number of patterns in the innermost turn on the functionality of the coil substrate.

Are there any limitations to the design of the coil substrate described in the patent application?

The abstract does not mention any potential limitations or drawbacks of the coil substrate design, leaving room for further exploration and analysis.


Original Abstract Submitted

the present specification relates to a coil substrate. a coil substrate according to one embodiment of the present specification comprises: a substrate; and a coil which is mounted on one surface of the substrate and comprises a plurality of turns, wherein the plurality of turns comprise a first inner turn located at the innermost side of the coil and a first outer turn located at the outermost side of the coil, wherein the first inner turn comprises a greater number of patterns than the first outer turn.