Kioxia corporation (20240096690). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shingo Honda of Yokkaichi Mie (JP)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096690 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a first layer with a first recess portion on its upper surface and a second recess portion that extends from the bottom surface of the first recess portion in the first layer. The second recess portion has a tapered shape where the width reduces from the bottom surface of the first recess portion in the depth direction of the first layer.
- The semiconductor device includes a first layer with a first recess portion on its upper surface.
- A second recess portion extends from the bottom surface of the first recess portion in the first layer.
- The second recess portion has a tapered shape with a width that reduces from the bottom surface of the first recess portion in the depth direction of the first layer.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Electronic devices
Problems Solved
This technology helps in:
- Improving semiconductor device performance
- Enhancing device miniaturization
Benefits
The benefits of this technology include:
- Increased efficiency in semiconductor devices
- Better heat dissipation
- Enhanced overall device performance
Potential Commercial Applications
The potential commercial applications of this technology include:
- Consumer electronics
- Automotive industry
Possible Prior Art
There is no known prior art for this specific semiconductor device design.
Unanswered Questions
How does this technology impact the cost of semiconductor manufacturing?
The abstract does not provide information on the cost implications of implementing this technology in semiconductor manufacturing processes.
What are the environmental implications of using this technology in electronic devices?
The abstract does not address the potential environmental impact of incorporating this semiconductor device design in electronic devices.
Original Abstract Submitted
a semiconductor device includes a first layer including a first recess portion on an upper surface; and a second recess portion that extends from a bottom surface of the first recess portion in the first layer, and the second recess portion has a tapered shape in which a width in a first direction along a surface direction of the first layer reduces from the bottom surface of the first recess portion in a depth direction of the first layer.
