International business machines corporation (20240136289). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract
Contents
- 1 VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
Organization Name
international business machines corporation
Inventor(s)
Rajiv Joshi of Yorktown Heights NY (US)
Ruilong Xie of Niskayuna NY (US)
VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136289 titled 'VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
Simplified Explanation
The present invention relates to a method and structure for providing a virtual power supply through a wafer backside. In one embodiment, a front end of line structure with a gate is formed, along with a back end of line structure on one surface of the front end of line structure. A backside power delivery network is formed on the opposite surface of the front end of line structure, connecting source and drain regions to the power delivery network.
- Front end of line structure with gate formation
- Back end of line structure formation on one surface
- Backside power delivery network formation on opposite surface
- Connection of source and drain regions to power delivery network
Potential Applications
This technology could be applied in the semiconductor industry for the development of more efficient and compact power delivery systems in integrated circuits.
Problems Solved
This innovation solves the problem of providing a virtual power supply through the wafer backside, improving power delivery efficiency and reducing the overall size of power delivery networks in semiconductor devices.
Benefits
The benefits of this technology include enhanced power delivery efficiency, reduced space requirements, and potentially lower manufacturing costs for integrated circuits.
Potential Commercial Applications
Potential commercial applications of this technology include the production of more advanced and energy-efficient electronic devices, such as smartphones, computers, and other consumer electronics.
Possible Prior Art
One possible prior art for this technology could be the use of traditional front end of line and back end of line structures for power delivery in integrated circuits. However, the specific implementation of a virtual power supply through the wafer backside may be a novel aspect of this invention.
Unanswered Questions
How does this technology impact the overall performance of integrated circuits?
This article does not delve into the specific performance improvements that this technology may bring to integrated circuits in terms of power efficiency or speed.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential obstacles or difficulties that may arise when scaling up the production of integrated circuits using this virtual power supply method.
Original Abstract Submitted
embodiments of the present invention are directed to processing methods and resulting structures for providing a virtual power supply through a wafer backside. in a non-limiting embodiment of the invention, a front end of line structure having a gate is formed and a back end of line structure is formed on a first surface of the front end of line structure. a backside power delivery network is formed on a second surface of the front end of line structure opposite the first surface. source and drain regions on a first side of the gate are connected to the backside power delivery network and source and drain regions on a second side of the gate are connected to the back end of line structure.
