International business machines corporation (20240136270). DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY simplified abstract

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

Organization Name

international business machines corporation

Inventor(s)

Francesco Preda of New Braunfels TX (US)

Sungjun Chun of Austin TX (US)

Jose A. Hejase of Pflugerville TX (US)

Junyan Tang of Austin TX (US)

Pavel Roy Paladhi of Pflugerville TX (US)

Nam Huu Pham of Round Rock TX (US)

Wiren Dale Becker of Hyde Park NY (US)

Daniel Mark Dreps of Georgetown TX (US)

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136270 titled 'DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

Simplified Explanation

The enhanced integrated circuit interconnect package, method, and multiple-layer integrated circuit laminate structure described in the abstract enable increased routing density per layer while maintaining signal integrity performance. A differential signal via pair of vertical interconnect vias provides differential signaling, with the vias positioned closely spaced together and offset from a center axis of an associated LGA contact to minimize space between the vias and maintain signal integrity performance, thus providing increased available wiring signal channel.

• Differential signal via pair of vertical interconnect vias for differential signaling
• Viability of closely spaced vias with offset positioning for signal integrity and increased wiring signal channel

Potential Applications

The technology described in this patent application could be applied in high-speed data transmission systems, telecommunications equipment, and advanced computing devices.

Problems Solved

This technology solves the problem of limited routing density in integrated circuit packages while maintaining signal integrity performance, which is crucial for high-speed data transmission.

Benefits

The benefits of this technology include increased routing density per layer, improved signal integrity performance, and enhanced overall performance of integrated circuit packages.

Potential Commercial Applications

The technology could be utilized in the development of next-generation computer processors, networking equipment, and other high-performance electronic devices.

Possible Prior Art

One possible prior art could be the use of differential signaling in interconnect packages, but the specific configuration of closely spaced vias with offset positioning may be a novel aspect of this technology.

How does this technology compare to existing methods for achieving differential signaling in integrated circuit packages?

This article does not provide a direct comparison to existing methods for achieving differential signaling in integrated circuit packages. Further research or a comparative analysis would be needed to address this question.

What are the potential challenges or limitations of implementing this technology in practical applications?

The article does not discuss potential challenges or limitations of implementing this technology in practical applications. Factors such as cost, manufacturing complexity, and compatibility with existing systems could be important considerations to explore further.

Original Abstract Submitted

an enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. a differential signal via pair of vertical interconnect vias provide differential signaling. the vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated lga contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.