International business machines corporation (20240136253). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

Organization Name

international business machines corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Ruilong Xie of Niskayuna NY (US)

Baozhen Li of South Burlington VT (US)

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136253 titled 'ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

Simplified Explanation

The semiconductor device described in the patent application includes a backside power rail, a backside ground rail, and a backside isolation rail between them. The backside isolation rail provides electrical isolation between the power and ground rails, allowing them to be located close to each other and preventing electrical shorts.

• Backside power rail, ground rail, and isolation rail are key components of the semiconductor device.
• The backside isolation rail prevents electrical shorts between the power and ground rails.
• The design enables the power and ground rails to be positioned near each other, improving efficiency.

Potential Applications

This technology could be applied in various semiconductor devices where close proximity of power and ground rails is required, such as integrated circuits, microprocessors, and memory chips.

Problems Solved

This innovation solves the problem of electrical shorts between power and ground rails in semiconductor devices, ensuring proper functionality and preventing damage.

Benefits

The backside isolation rail allows for more compact and efficient semiconductor device designs, reducing the risk of electrical issues and improving overall performance.

Potential Commercial Applications

"Optimizing Semiconductor Device Efficiency with Backside Isolation Rail Technology"

Possible Prior Art

There may be prior art related to methods of providing electrical isolation between power and ground rails in semiconductor devices, but specific examples are not provided in this patent application.

How does this technology impact the overall cost of semiconductor device production?

The cost implications of implementing this technology in semiconductor devices are not addressed in the patent application. Further research and analysis would be needed to determine the cost-effectiveness of this innovation.

What are the potential challenges in scaling this technology for mass production?

The scalability of this technology for mass production is not discussed in the patent application. Factors such as manufacturing processes, materials, and quality control measures would need to be considered when scaling up production.

Original Abstract Submitted

a semiconductor device includes a backside power rail, a backside ground rail, and a backside isolation rail between the backside power rail and the backside ground rail. the backside isolation rail may provide adequate electrical isolation between the backside power rail and the backside ground rail, thereby enabling the backside power rail and the backside ground rail to be located relatively near to one another. the backside isolation rail may also cure actual electrical shorts between the backside power rail and the backside ground rail.