International business machines corporation (20240128191). POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL simplified abstract
Contents
- 1 POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
Organization Name
international business machines corporation
Inventor(s)
Tsung-Sheng Kang of Ballston Lake NY (US)
Koichi Motoyama of Clifton Park NY (US)
Oscar Van Der Straten of Guilderland Center NY (US)
Alexander Reznicek of Troy NY (US)
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128191 titled 'POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
Simplified Explanation
The semiconductor structure described in the abstract includes a backside power rail within a backside dielectric layer, along with dielectric spacer layers extending inwardly from the sidewalls of the backside dielectric layer and a portion of the bottom surface of the backside power rail.
- The semiconductor structure features a backside power rail placed within a backside dielectric layer.
- Dielectric spacer layers extend inwardly from the opposing sidewalls of the backside dielectric layer and a portion of the bottom surface of the backside power rail.
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor manufacturing
- Power management systems
- Integrated circuits
Problems Solved
This technology helps to address issues related to:
- Power distribution in semiconductor devices
- Efficient heat dissipation
- Reduction of signal interference
Benefits
The benefits of this technology include:
- Improved power distribution efficiency
- Enhanced thermal management
- Reduced signal interference
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Consumer electronics
- Automotive electronics
- Telecommunications equipment
Possible Prior Art
One possible prior art related to this technology is the use of dielectric spacer layers in semiconductor structures for improved performance and reliability.
Unanswered Questions
How does this technology compare to existing power rail designs in terms of efficiency and performance?
This article does not provide a direct comparison with existing power rail designs to evaluate efficiency and performance.
What are the specific manufacturing processes involved in implementing this semiconductor structure?
The article does not delve into the specific manufacturing processes required to implement this semiconductor structure.
Original Abstract Submitted
a semiconductor structure includes a backside power rail disposed in a backside dielectric layer, and dielectric spacer layers laterally extending inwardly from opposing sidewalls of the backside dielectric layer and on a portion of a bottom surface of the backside power rail.
