International business machines corporation (20240121890). TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES simplified abstract

TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES

Organization Name

international business machines corporation

Inventor(s)

Arthur J. Higby of Cottekill NY (US)

DAVID CLIFFORD Long of WAPPINGERS FALLS NY (US)

James Busby of New Paltz NY (US)

William Santiago-fernandez of Hopewell Junction NY (US)

John R. Dangler of Rochester MN (US)

Russell A. Budd of North Salem NY (US)

Philipp K Buchling Rego of Wappingers Falls NY (US)

Hannah Wendling of Poughquag NY (US)

Lauren Boston of Poughkeepsie NY (US)

TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240121890 titled 'TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES

Simplified Explanation

The patent application describes a circuitry substrate structure designed to secure an area from tampering by incorporating tamper enclosures that can be delaminated when a removal force is applied.

• The structure includes a circuitry substrate with top and bottom tamper enclosures covering a component in a protected area.
• The tamper enclosures are adhesively bonded to the surface of the circuitry substrate.
• A tear initiation site is added to the perimeter of the circuitry substrate bordering the protected area, enabling delamination of internal layers and severing of a security circuit when a removal force is applied.

Potential Applications

This technology could be applied in various industries where secure circuitry is essential, such as in electronic devices, security systems, and military equipment.

Problems Solved

This technology addresses the issue of tampering and unauthorized access to sensitive components by providing a tamper-evident structure that can detect and prevent tampering attempts.

Benefits

The benefits of this technology include enhanced security measures, protection of sensitive information, and the ability to detect tampering quickly and effectively.

Potential Commercial Applications

Potential commercial applications of this technology include secure electronic devices, tamper-proof security systems, and military equipment with enhanced security features.

Possible Prior Art

One possible prior art for this technology could be tamper-evident seals used in the packaging industry to detect unauthorized access to products.

=== What materials are used in the tamper enclosures? The patent application does not specify the materials used in the tamper enclosures.

=== How does the tear initiation site work to enable delamination? The patent application does not provide detailed information on the specific mechanism of the tear initiation site for enabling delamination.

Original Abstract Submitted

a structure of a circuitry substrate for securing an area from tampering is disclosed. the structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. the top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.