International business machines corporation (20240113013). SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract
Contents
- 1 SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Organization Name
international business machines corporation
Inventor(s)
Huai Huang of Clifton Park NY (US)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
Hosadurga Shobha of Niskayuna NY (US)
Ruilong Xie of Niskayuna NY (US)
Lawrence A. Clevenger of Saratoga Springs NY (US)
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113013 titled 'SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
Simplified Explanation
The semiconductor structure described in the abstract consists of an interconnect line with multiple conducting line segments separated by isolating layers. Additionally, the structure includes vertically stacked conducting line segments.
- The semiconductor structure includes a first portion of an interconnect line with a first conducting line segment and a second conducting line segment separated by an isolating layer.
- The structure also includes a second portion of the interconnect line with a third conducting line segment vertically stacked over at least a portion of the first and second conducting line segments.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
The semiconductor structure addresses the following issues:
- Efficient signal transmission
- Reduction of signal interference
- Improved performance of electronic devices
Benefits
The benefits of this technology include:
- Enhanced signal integrity
- Higher data transmission speeds
- Increased reliability of electronic components
Potential Commercial Applications
The semiconductor structure could find commercial applications in:
- Microprocessor manufacturing
- Memory chip production
- Consumer electronics development
Possible Prior Art
One example of prior art in this field is the use of multilayer interconnect structures in semiconductor devices to improve signal transmission and reduce cross-talk between conducting lines.
Unanswered Questions
How does this technology compare to existing interconnect structures in terms of performance and efficiency?
The article does not provide a direct comparison between this technology and existing interconnect structures.
What are the potential challenges in implementing this semiconductor structure in mass production?
The article does not address the potential challenges that may arise in the mass production of semiconductor devices using this technology.
Original Abstract Submitted
a semiconductor structure comprises a first portion of an interconnect line comprising a first conducting line segment and a second conducting line segment separated by an isolating layer, and a second portion of the interconnect line comprising a third conducting line segment vertically stacked over at least a portion of the first conducting line segment and at least a portion of the second conducting line segment.
