International Business Machines Corporation patent applications published on November 30th, 2023

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Summary of the patent applications from International Business Machines Corporation on November 30th, 2023

Recently, International Business Machines Corporation (IBM) has filed several patents related to various technologies. These patents cover a range of areas including memory devices, electromagnetic compatibility (EMC) protection apparatus, device identification, access policy optimization, semiconductor devices, CMOS devices, microelectronic structures, contact and gate regions, and language learning through content translation.

In the field of memory devices, IBM has filed a patent for a memory device that includes a magnetic tunnel junction pillar and a sidewall spacer. This design aims to improve the performance and functionality of the memory device.

For EMC protection apparatus, IBM has filed a patent for a system and method to control the apparatus in a removable component inserted into an end product. The system detects a power good signal and rotates the EMC protection device to create an EMC seal.

In the area of device identification, IBM has filed a patent for a method to display identification information for devices connected to multiple ports. The method involves establishing communication between the device and the port and displaying the identification information on a display associated with the port.

IBM has also filed a patent for a system and method to analyze and optimize access policies. The system computes an access control health metric to measure the current state of access policies and identifies subgroups of policies for optimization.

In the field of semiconductor devices, IBM has filed a patent for a device design that includes a buried power rail, buried oxide layer, channel fins, bottom epitaxial layer, gate stack, and top epitaxial layer. This design aims to improve electrical connectivity and performance.

IBM has also filed a patent for a CMOS device with a pFET epi and an nFET epi, each having specific dielectric layers and trench structures.

In the area of microelectronic structures, IBM has filed a patent for a structure with stacked device regions, gate cut regions, and interconnects connecting different devices within the stacked region.

IBM has also filed a patent for a microelectronics device with a specific design for the contact and gate regions, including tapered sidewalls.

Lastly, IBM has filed a patent for a magnetic tape head, magnetic tape drive, and computational device, although further details are not provided in the abstract.

Notable applications:

  • Memory device with magnetic tunnel junction pillar and sidewall spacer.
  • System and method for controlling EMC protection apparatus in a removable component.
  • Method for displaying identification information for devices connected to multiple ports.
  • System and method for analyzing and optimizing access policies.
  • Semiconductor device with buried power rail, buried oxide layer, and gate stack.
  • CMOS device with specific dielectric layers and trench structures.
  • Microelectronic structure with stacked device regions and interconnects.
  • Microelectronics device with specific design for contact and gate regions.
  • Magnetic tape head, magnetic tape drive, and computational device.



Patent applications for International Business Machines Corporation on November 30th, 2023

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