Intel corporation (20240136292). MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract
Contents
- 1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Organization Name
Inventor(s)
Omkar G. Karhade of Chandler AZ (US)
Edvin Cetegen of Chandler AZ (US)
Anurag Tripathi of Gilbert AZ (US)
Nitin A. Deshpande of Chandler AZ (US)
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136292 titled 'MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Simplified Explanation
The abstract describes a patent application for microelectronic structures that include bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
- Microelectronic structures with bridges
- Assemblies and methods related to microelectronic structures
- Substrate and bridge in some embodiments
Potential Applications
The technology could be applied in:
- Microelectronics industry
- Semiconductor manufacturing
- Nanotechnology research
Problems Solved
This technology addresses:
- Enhancing structural integrity
- Improving electrical connectivity
- Facilitating miniaturization of electronic devices
Benefits
The benefits of this technology include:
- Increased efficiency in electronic components
- Enhanced performance of microelectronic devices
- Potential cost savings in manufacturing processes
Potential Commercial Applications
With its advantages, this technology could find applications in:
- Consumer electronics
- Medical devices
- Aerospace industry
Possible Prior Art
Prior art in microelectronic structures and bridges may include:
- Existing patents related to semiconductor devices
- Research papers on nanoscale structures
Unanswered Questions
How does this technology compare to existing microelectronic structures with bridges?
This article does not provide a direct comparison with existing technologies in the field.
What are the specific methods used in the assembly of these microelectronic structures?
The article does not delve into the detailed assembly processes involved in creating these microelectronic structures.
Original Abstract Submitted
disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. in some embodiments, a microelectronic structure may include a substrate and a bridge.
