Intel corporation (20240136243). COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

Organization Name

intel corporation

Inventor(s)

Min Suet Lim of Gelugor (MY)

Telesphor Kamgaing of Chandler AZ (US)

Ilan Ronen of Hadera (IL)

Kavitha Nagarajan of Bangalore KA (IN)

Chee Kheong Yoon of Beyan Lepas (MY)

Chu Aun Lim of Hillsboro OR (US)

Eng Huat Goh of Penang (MY)

Jooi Wah Wong of Bukit Mertajam (MY)

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136243 titled 'COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

Simplified Explanation

The abstract describes an integrated circuit device with semiconductor devices located near the center of the device, allowing heat to become trapped inside. Copper fill is used to transfer heat away from the semiconductor devices towards a heat spreader.

• Semiconductor devices are positioned near the center of the integrated circuit device.
• Heat can become trapped inside the device due to this arrangement.
• Copper fill is formed over the semiconductor devices and front side interconnect structures to transfer heat away.
• The heat is directed towards a heat spreader to dissipate it effectively.

Potential Applications

The technology described in the patent application could be applied in various electronic devices where heat dissipation is crucial, such as:

• High-performance computing systems
• Data centers
• Automotive electronics

Problems Solved

The technology addresses the issue of heat buildup within integrated circuit devices by efficiently transferring heat away from the semiconductor devices, preventing overheating and potential damage.

Benefits

The benefits of this technology include:

• Improved thermal management
• Enhanced reliability of electronic devices
• Increased performance and longevity of integrated circuits

Potential Commercial Applications

The technology could find commercial applications in industries such as:

• Electronics manufacturing
• Telecommunications
• Aerospace

Possible Prior Art

One possible prior art related to this technology is the use of heat spreaders in electronic devices to dissipate heat efficiently. However, the specific arrangement of semiconductor devices near the center of the device with copper fill for heat transfer may be a novel approach.

How does this technology compare to traditional heat dissipation methods in integrated circuit devices?

This article does not provide a direct comparison between this technology and traditional heat dissipation methods. Further research or experimentation may be needed to evaluate the effectiveness of this approach compared to existing methods.

What are the potential challenges or limitations of implementing this technology in practical applications?

The article does not address any potential challenges or limitations that may arise when implementing this technology in real-world scenarios. Additional studies or testing may be required to identify and overcome any obstacles in commercializing this innovation.

Original Abstract Submitted

described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. in this arrangement, heat can become trapped inside the device. metal fill, such as copper, is formed within a portion of the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices and towards a heat spreader.