Intel corporation (20240133799). WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract
Contents
- 1 WAFER-LEVEL BOND STRENGTH MEASUREMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER-LEVEL BOND STRENGTH MEASUREMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WAFER-LEVEL BOND STRENGTH MEASUREMENT
Organization Name
Inventor(s)
Khaled Ahmed of San Jose CA (US)
WAFER-LEVEL BOND STRENGTH MEASUREMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240133799 titled 'WAFER-LEVEL BOND STRENGTH MEASUREMENT
Simplified Explanation
The patent application describes a device for measuring bond strength, comprising a plate with a sticky probe and a mirror, connected to a movement mechanism and an optical fiber sensor assembly.
- The device includes a plate with three portions: one connected to a movement mechanism, one with a sticky probe, and one with a mirror.
- An optical fiber sensor assembly is included, with a bundle for sending and receiving light through optical fibers.
- The mirror has a reflective side pointing outwards for light reflection.
Potential Applications
This technology could be used in industries such as construction, aerospace, and automotive for testing bond strength in various materials.
Problems Solved
This device provides a non-destructive way to measure bond strength, allowing for accurate testing without damaging the materials being assessed.
Benefits
The device offers a precise and reliable method for measuring bond strength, which can help ensure the quality and safety of products and structures.
Potential Commercial Applications
"Non-Destructive Bond Strength Measurement Device for Industrial Applications" - This title is optimized for SEO to attract potential commercial users looking for a solution to measure bond strength without damaging materials.
Possible Prior Art
There may be prior art related to devices for measuring bond strength using optical fiber sensors or mirrors, but specific examples are not provided in the abstract.
Unanswered Questions
How does the device handle different types of materials with varying bond strengths?
The abstract does not mention how the device can be calibrated or adjusted to account for different materials and their bond strength levels.
Are there any limitations to the size or shape of the materials that can be tested with this device?
It is not clear from the abstract whether the device is suitable for testing bond strength in materials of all sizes and shapes, or if there are limitations to consider.
Original Abstract Submitted
this disclosure describes systems, methods, and devices related to bond strength measurement. a device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. the device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
