Intel corporation (20240128223). ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES simplified abstract

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

Organization Name

intel corporation

Inventor(s)

Bernd Waidhas of Pettendorf (DE)

Andreas Wolter of Regensburg (DE)

Georg Seidemann of Landshut (DE)

Thomas Wagner of Regelsbach (DE)

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128223 titled 'ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

Simplified Explanation

The abstract describes an electronic package with multiple embedded dies and a bridge die for electrical coupling between pads of different pitches.

• Electronic package with multiple embedded dies:

 - The package includes a mold layer with a first die embedded in it, which has pads at different pitches.
 - A second die is also embedded in the mold layer, with pads at different pitches from the first die.
 - A bridge die is included in the mold layer to electrically couple pads of different pitches from the first and second dies.

• • Potential Applications:**

This technology could be used in various electronic devices such as smartphones, tablets, and laptops where multiple dies need to be integrated into a compact package.

• • Problems Solved:**

This technology solves the problem of efficiently integrating multiple dies with pads at different pitches into a single electronic package.

• • Benefits:**

The benefits of this technology include increased functionality in a smaller form factor, improved electrical coupling between dies, and potentially lower manufacturing costs.

• • Potential Commercial Applications of this Technology:**

The potential commercial applications of this technology could be in the semiconductor industry for manufacturing advanced electronic devices with multiple integrated dies.

• • Possible Prior Art:**

One possible prior art could be the use of wire bonding or flip-chip technology to connect dies with different pad pitches in electronic packages.

• • Unanswered Questions:**

1. How does the bridge die ensure proper electrical coupling between pads of different pitches?

  *Answer:* The bridge die likely has connections that span the different pitches of the pads, allowing for proper electrical coupling.

2. What materials are typically used for the mold layer in such electronic packages?

  *Answer:* The mold layer is usually made of materials like epoxy resins or polymers that provide insulation and protection for the embedded dies.

Original Abstract Submitted

embodiments disclosed herein include electronic package and methods of forming such packages. in an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. in an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. in an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. in an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.