Intel corporation (20240123561). MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract
Contents
- 1 MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
Organization Name
Inventor(s)
Yosef Kornbluth of Phoenix AZ (US)
Whitney Bryks of Tempe AZ (US)
Ravindranadh Tagore Eluri of Tempe AZ (US)
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240123561 titled 'MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
Simplified Explanation
The patent application describes a system for enhanced plate polishing by placing a liquid between a plate and a wafer and utilizing a controller to vary current flowing through coils to apply pressure on the plate.
- Liquid is placed between a plate and a wafer
- Controller varies current flowing through coils
- Pressure is applied on the plate to press against the liquid and the wafer
Potential Applications
This technology could be used in semiconductor manufacturing processes for polishing wafers.
Problems Solved
This technology solves the problem of achieving enhanced plate polishing in a controlled and efficient manner.
Benefits
The benefits of this technology include improved polishing results, increased efficiency, and better control over the polishing process.
Potential Commercial Applications
"Enhanced Plate Polishing Technology for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to plate polishing systems in semiconductor manufacturing processes, but specific examples are not provided in the abstract.
Unanswered Questions
How does the controller precisely control the current flowing through the coils?
The patent application does not provide details on the specific mechanisms or technology used by the controller to vary the current flow through the coils.
What are the potential limitations or drawbacks of this enhanced plate polishing system?
The abstract does not mention any potential limitations or drawbacks of the system, leaving room for further exploration and analysis in this area.
Original Abstract Submitted
this disclosure describes systems, methods, and devices related to enhanced plate polishing. a device may place a liquid between a plate and a wafer. the device may utilize a controller to vary a current flowing through an array of coils. the device may apply pressure on the plate to press against the liquid and the wafer.
