DIRECTLY COUPLED OPTICAL INTERPOSER

The device described in the abstract is a substrate with an integrated optical waveguide and a hole that houses an IC die, potentially a photonic IC. The optical waveguide runs parallel to the first surface of the substrate and extends to the first sidewall of the hole, where it aligns with an optical port on the IC die. The substrate may also have a recess to accommodate another device with a socket.

Substrate with integrated optical waveguide and hole for IC die
Optical waveguide parallel to substrate surface, extending to hole sidewall
IC die with optical port aligned with waveguide end
Substrate may have recess for additional device with socket

Potential Applications

The technology could be used in:

High-speed data communication systems
Optical sensing devices
Photonic integrated circuits

Problems Solved

Efficient optical signal transmission
Compact design for integrated photonics
Alignment of optical components

Benefits

Improved data transfer speeds
Space-saving design
Enhanced optical performance

Potential Commercial Applications

Optical networking equipment for:

Data centers
Telecommunication networks
Aerospace and defense industries

Possible Prior Art

One possible prior art could be the integration of optical waveguides with IC dies in a similar manner, but without the specific alignment features described in this patent application.

Unanswered Questions

How does this technology compare to existing optical interconnect solutions in terms of performance and cost?

This article does not provide a direct comparison with existing optical interconnect solutions in terms of performance and cost. It would be beneficial to understand how this technology stacks up against current industry standards.

What are the potential challenges in manufacturing and scaling up production of devices using this technology?

The article does not address the potential challenges in manufacturing and scaling up production of devices using this technology. It would be important to consider the feasibility of mass production and any obstacles that may arise in the manufacturing process.

Original Abstract Submitted

a device comprises a substrate and an ic die, which may be a photonic ic. the substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. the hole comprises a first sidewall. the optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. the ic die is within the hole and comprises a second sidewall and an optical port at the second sidewall. the second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. the substrate may include a recess to receive another device comprising a socket.

Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract

Contents

DIRECTLY COUPLED OPTICAL INTERPOSER

Organization Name

Inventor(s)