Intel corporation (20240114697). GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM simplified abstract

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GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM

Organization Name

intel corporation

Inventor(s)

Shriram Shivaraman of Hillsboro OR (US)

Sou-Chi Chang of Portland OR (US)

Sourav Dutta of Hillsboro OR (US)

Uygar E. Avci of Portland OR (US)

GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240114697 titled 'GAIN CELL USING PLANAR AND TRENCH FERROELECTRIC AND ANTI-FERROELECTRIC CAPACITORS FOR EDRAM

Simplified Explanation

The memory device described in the abstract consists of a first transistor for writing data, a ferroelectric capacitor for storing data, and a second transistor for reading the data stored on the ferroelectric capacitor.

  • The memory device includes a first transistor as an access transistor for writing data.
  • The memory device incorporates a ferroelectric capacitor for data storage.
  • The memory device features a second transistor as a sense transistor for reading the data stored on the ferroelectric capacitor.

Potential Applications

This memory device technology could be applied in:

  • Non-volatile memory systems
  • Embedded systems
  • IoT devices

Problems Solved

This technology helps address:

  • Data retention issues in memory devices
  • Improving data access speeds
  • Enhancing overall memory performance

Benefits

The benefits of this technology include:

  • Faster data access and retrieval
  • Improved data storage efficiency
  • Enhanced reliability and durability of memory devices

Potential Commercial Applications

This technology could be utilized in:

  • Consumer electronics
  • Automotive systems
  • Medical devices

Possible Prior Art

One possible prior art for this technology could be the use of ferroelectric capacitors in memory devices for data storage.

Unanswered Questions

How does this memory device technology compare to traditional memory devices in terms of speed and efficiency?

This article does not provide a direct comparison between this memory device technology and traditional memory devices in terms of speed and efficiency.

What are the potential challenges in implementing this memory device technology on a large scale for commercial applications?

This article does not address the potential challenges in implementing this memory device technology on a large scale for commercial applications.


Original Abstract Submitted

embodiments disclosed herein include a memory device. in an embodiment, the memory device comprises a first transistor, where the first transistor is an access transistor to write data. in an embodiment, the memory device further comprises a ferroelectric capacitor for storing data. in an embodiment, the memory device further comprises a second transistor, where the second transistor is a sense transistor to read the data stored on the ferroelectric capacitor.