Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
Contents
- 1 HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Organization Name
Inventor(s)
Kristof Darmawikarta of Chandler AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Sameer Paital of Chandler AZ (US)
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114623 titled 'HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
Simplified Explanation
The abstract describes an electronic device with a glass core layer, passive electronic components, and hybrid bonds between contact pads.
- Glass core layer with first contact pads
- Passive electronic components on first surface with second contact pads
- Hybrid bonds between first contact pads and second contact pads
Potential Applications
This technology could be used in various electronic devices such as sensors, medical devices, and communication systems.
Problems Solved
This technology solves the problem of integrating passive electronic components onto a glass substrate, providing a more compact and efficient electronic device design.
Benefits
The benefits of this technology include improved reliability, reduced size and weight, and enhanced performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include consumer electronics, automotive electronics, and industrial automation systems.
Possible Prior Art
One possible prior art could be the integration of passive electronic components on traditional substrates such as FR4 or ceramic materials.
Unanswered Questions
How does the reliability of the hybrid bonds compare to traditional bonding methods?
The article does not provide information on the reliability comparison between hybrid bonds and other bonding methods.
Are there any limitations to the size or type of passive electronic components that can be integrated using this technology?
The article does not address any potential limitations regarding the size or type of passive electronic components that can be integrated on the glass core layer.
Original Abstract Submitted
an electronic device includes a substrate including a glass core layer and first contact pads on a first surface of the glass core layer; one or more discrete passive electronic components disposed on the first surface of the glass core layer, the one or more discrete passive electronic components including second contact pads on a bottom surface of the one or more discrete passive electronic components; and hybrid bonds between the first contact pads of the glass core layer and the second contact pads of the one or more discrete passive electronic components.
