Intel corporation (20240113438). PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION simplified abstract

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PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION

Organization Name

intel corporation

Inventor(s)

Zhen Zhou of Chandler AZ (US)

Shuhei Yamada of Hillsboro OR (US)

Renzhi Liu of Portland OR (US)

Tae Young Yang of Portland OR (US)

Tolga Acikalin of San Jose CA (US)

Kenneth P. Foust of Beaverton OR (US)

PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113438 titled 'PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION

Simplified Explanation

The patent application describes a package-to-package communication system involving two packages, each with integrated antennas and transceivers for communication.

  • The first package includes a first antenna, a second antenna, and a first transceiver on a substrate. The first antenna is along one edge, and the second antenna is along another edge.
  • The second package includes a third antenna, a fourth antenna, and a second transceiver on a substrate. The third antenna is along one edge, and the fourth antenna is along another edge.
  • The first and third antennas are for vertical polarization signals, while the second and fourth antennas are for horizontal polarization signals.

Potential Applications

This technology could be used in wireless communication systems, IoT devices, and smart home applications.

Problems Solved

This system solves the problem of efficient package-to-package communication, especially in scenarios where vertical and horizontal polarizations are required.

Benefits

The benefits of this technology include improved signal quality, reduced interference, and enhanced communication reliability.

Potential Commercial Applications

Potential commercial applications include telecommunications equipment, networking devices, and consumer electronics.

Possible Prior Art

One possible prior art could be existing package-to-package communication systems with integrated antennas and transceivers, but without the specific polarization configurations described in this patent application.

Unanswered Questions

How does this technology compare to existing package-to-package communication systems in terms of signal strength and reliability?

The article does not provide a direct comparison with existing systems in terms of signal strength and reliability.

What are the specific technical specifications of the antennas and transceivers used in this system?

The article does not detail the specific technical specifications of the antennas and transceivers used in this system.


Original Abstract Submitted

a package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. the first antenna is arranged along a first edge of the first substrate. the second antenna is arranged along a second edge of the first substrate. a second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. the third antenna is arranged along a third edge of the second substrate. the fourth antenna is arranged along a fourth edge of the second substrate. the first antenna and the third antenna are configured to communicate signals of a vertical polarization. the second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.