Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
Contents
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Whitney Bryks of Tempe AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Benjamin Duong of Phoenix AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113072 titled 'SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Simplified Explanation
The integrated circuit (IC) device described in the patent application comprises a glass core substrate with a build-up layer on at least one surface and a plurality of regions on the sidewall, each region containing a cavity with a concave surface.
- Glass core substrate with build-up layer:
- The IC device has a substrate made of glass with a build-up layer on at least one surface. - The glass core provides a stable base for the circuit components, while the build-up layer allows for additional circuitry to be added.
- Regions with cavities and concave surfaces:
- The sidewall of the glass core substrate contains multiple regions, each with a cavity. - These cavities have concave surfaces with varying depths, providing unique structures for circuit components.
Potential Applications: - This technology could be used in the development of advanced integrated circuits for various electronic devices. - It may find applications in high-performance computing, telecommunications, and consumer electronics.
Problems Solved: - The technology provides a novel way to integrate circuit components on a glass core substrate, potentially improving performance and reliability. - The concave surfaces of the cavities offer new possibilities for designing compact and efficient circuits.
Benefits: - Enhanced performance and reliability of integrated circuits. - Potential for miniaturization and increased functionality in electronic devices.
Potential Commercial Applications: - Advanced semiconductor manufacturing for high-tech industries. - Production of cutting-edge electronic devices with improved performance.
Possible Prior Art: - Prior art related to glass core substrates in semiconductor manufacturing. - Research on cavity structures in integrated circuits.
Unanswered Questions: 1. How does the concave surface of the cavities impact the electrical properties of the integrated circuit? 2. Are there any specific manufacturing processes required to create the regions with cavities on the glass core substrate?
Original Abstract Submitted
an integrated circuit (ic) device comprises a substrate comprising a glass core. the glass core includes a first surface, a second surface opposite the first surface, and a sidewall between the first surface and the second surface. a build-up layer is on at least the first surface. a plurality of regions is on the sidewall. each region comprises a cavity in the sidewall, wherein the cavity spans a first distance in a first direction from the first surface toward the second surface. in addition, the cavity comprises a concave surface having a first depth at the first surface and a second depth at the first distance, the second depth being less than the first depth.
