Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

Organization Name

intel corporation

Inventor(s)

Srinivasan Raman of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Jason Scott Steill of Phoenix AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Yi Yang of Gilbert AZ (US)

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113048 titled 'INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

Simplified Explanation

The patent application relates to embedding components in glass core layers for semiconductor assemblies. The semiconductor assembly includes a glass core with cavities where components are embedded, and a semiconductor die attached to the substrate.

• Glass core layers with embedded components for semiconductor assemblies
• Components embedded in glass core cavities
• Semiconductor die attached to the substrate

Potential Applications

The technology could be applied in various industries such as electronics, telecommunications, and automotive for advanced semiconductor assemblies.

Problems Solved

This technology solves the problem of integrating components into glass core layers for semiconductor assemblies, providing a more efficient and compact design.

Benefits

The benefits of this technology include improved reliability, reduced size, and enhanced performance of semiconductor assemblies.

Potential Commercial Applications

The technology could be commercially used in the manufacturing of advanced electronic devices, telecommunications equipment, and automotive systems.

Possible Prior Art

One possible prior art could be the use of traditional substrates for semiconductor assemblies instead of glass core layers with embedded components.

How does this technology impact the overall cost of semiconductor assemblies?

The cost implications of implementing glass core layers with embedded components in semiconductor assemblies are not addressed in the abstract.

What are the environmental implications of using glass core layers in semiconductor assemblies?

The environmental impact of using glass core layers with embedded components in semiconductor assemblies is not discussed in the abstract.

Original Abstract Submitted

various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. the present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.