Intel corporation (20240113027). INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS simplified abstract
Contents
- 1 INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS
Organization Name
Inventor(s)
Abhishek Anil Sharma of Portland OR (US)
INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113027 titled 'INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS
Simplified Explanation
The integrated circuit structure described in the abstract includes an interlayer dielectric (ILD) and an interconnect over the ILD, with the interconnect comprising a plurality of first layers made of metal and a plurality of second layers made of a two-dimensional (2D) material in an alternating pattern.
- The integrated circuit structure includes an ILD and an interconnect with alternating layers of metal and 2D material.
- The use of 2D materials in the interconnect provides unique properties and benefits to the overall structure.
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor manufacturing
- Electronics industry
- Nanotechnology research
Problems Solved
This technology helps address the following issues:
- Improving interconnect performance
- Enhancing overall circuit efficiency
- Reducing power consumption
Benefits
The use of 2D materials in the interconnect offers several advantages, including:
- Increased conductivity
- Better heat dissipation
- Enhanced signal transmission speed
Potential Commercial Applications
The technology could find commercial applications in:
- High-performance computing
- Telecommunications
- Consumer electronics
Possible Prior Art
One possible prior art could be the use of traditional metal interconnects in integrated circuit structures.
Unanswered Questions
How does the integration of 2D materials impact the overall cost of manufacturing integrated circuits?
The cost implications of using 2D materials in the interconnect layers are not addressed in the abstract. Further research or analysis may be needed to determine the economic feasibility of this technology.
What are the potential challenges or limitations of incorporating 2D materials into the interconnect layers?
The abstract does not mention any potential drawbacks or obstacles associated with using 2D materials in the interconnect. Additional investigation could shed light on any challenges that may arise during implementation.
Original Abstract Submitted
embodiments disclosed herein include an integrated circuit structure. in an embodiment, the integrated circuit structure comprises an interlayer dielectric (ild). and an interconnect over the ild. in an embodiment, the interconnect comprises a plurality of first layers, where the first layers comprise a metal, and a plurality of second layer in an alternating pattern with the plurality of first layers. in an embodiment, the second layers comprise a two-dimensional (2d) material.
