Intel corporation (20240112999). LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract
Contents
- 1 LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS
Organization Name
Inventor(s)
Jieying Kong of Chandler AZ (US)
Houssam Jomaa of San Diego CA (US)
Dilan Seneviratne of Phoenix AZ (US)
Whitney Bryks of Tempe AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Phoenix AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240112999 titled 'LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS
Simplified Explanation
The electronic system described in the patent application comprises a substrate with a core layer made of at least one layer of glass. The glass layers are stacked with a dielectric material between each layer, and they can be prepatterned before assembly of the layered glass core system.
- Glass layers are used in the core layer of the electronic system.
- Dielectric material is placed between each layer of glass.
- Glass layers can be prepatterned before assembly.
Potential Applications
The technology described in the patent application could be applied in:
- Electronics manufacturing
- Semiconductor industry
- Telecommunications
Problems Solved
This technology helps to:
- Improve the performance of electronic systems
- Enhance the durability of substrates
- Increase the efficiency of dielectric materials
Benefits
The benefits of this technology include:
- Enhanced reliability of electronic systems
- Improved signal transmission
- Reduced signal interference
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Printed circuit board manufacturing
- Integrated circuit production
- Telecommunication equipment development
Possible Prior Art
One possible prior art for this technology could be the use of glass layers in electronic substrates in a similar manner, but without the pre-patterning process.
Unanswered Questions
How does this technology compare to existing glass layer substrates in terms of performance and cost?
This article does not provide a direct comparison between this technology and existing glass layer substrates. Further research or testing may be needed to determine the performance and cost differences.
What specific types of dielectric materials are most effective when used between glass layers in electronic systems?
The article does not specify the types of dielectric materials used between glass layers. Additional information or experimentation may be required to identify the most effective options.
Original Abstract Submitted
an electronic system comprising can have a substrate with a core layer formed from at least one layer of glass. the glass layers can each be stacked with a dielectric material disposed between each layer of glass. the glass layers can be prepatterned before assembly of the layered glass core system.
