Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Organization Name

intel corporation

Inventor(s)

Yiqun Bai of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Ziyin Lin of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Kyle Arrington of Gilbert AZ (US)

Bohan Shan of Chandler AZ (US)

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240112971 titled 'SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Simplified Explanation

The integrated circuit (IC) device described in the patent application comprises a glass core substrate with a first surface, a second surface, and a first sidewall. The glass core includes a conductor within a through-glass via and a build-up layer. The first sidewall has laser-treated areas with nanoporosity.

• Glass core substrate with first and second surfaces, and a first sidewall
• Conductor within a through-glass via and a build-up layer
• Laser-treated areas on the first sidewall with nanoporosity

1. 1. 1. Potential Applications

This technology could be used in the development of high-performance integrated circuits for various electronic devices.

1. 1. 1. Problems Solved

This innovation helps improve the performance and reliability of integrated circuits by utilizing a glass core substrate with laser-treated areas for enhanced functionality.

1. 1. 1. Benefits

- Enhanced performance and reliability of integrated circuits - Potential for miniaturization and increased functionality - Improved manufacturing processes for electronic devices

1. 1. 1. Potential Commercial Applications

The technology could be applied in the production of advanced electronic devices such as smartphones, tablets, and computers.

1. 1. 1. Possible Prior Art

Prior art may include similar patents or research papers related to the use of glass substrates in integrated circuits and laser treatment for nanoporosity.

1. 1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does the nanoporosity affect the performance of the integrated circuit?

The nanoporosity created by laser treatment may impact the electrical properties of the circuit, but the specific effects are not detailed in the abstract.

1. 1. 1. 1. What are the specific manufacturing processes involved in creating the laser-treated areas on the glass core?

The abstract mentions laser-treated areas on the glass core, but it does not provide information on the specific techniques or equipment used in the manufacturing process.

Original Abstract Submitted

an integrated circuit (ic) device comprises a substrate comprising a glass core. the glass core comprises a first surface and a second surface opposite the first surface, and a first sidewall between the first surface and the second surface. the glass core may include a conductor within a through-glass via extending from the first surface to the second surface and a build-up layer. the glass cord comprises a plurality of first areas of the glass core and a plurality of laser-treated areas on the first sidewall. a first one of the plurality of laser-treated areas may be spaced away from a second one of the plurality of laser-treated areas. a first area may comprise a first nanoporosity and a laser-treated area may comprise a second nanoporosity, wherein the second nanoporosity is greater than the first nanoporosity.