Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
Contents
- 1 DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE
Organization Name
Inventor(s)
Robert Alan May of Chandler AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Sri Ranga Sai Sai Boyapati of Chandler AZ (US)
DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105621 titled 'DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE
Simplified Explanation
The abstract describes a patent application for a die interconnect substrate with a bridge die embedded in a multilayer substrate structure, featuring a bridge interconnect and electrically insulating filler structure.
- The die interconnect substrate includes a bridge die with at least one bridge interconnect connecting two bridge die pads.
- The multilayer substrate structure houses the bridge die and includes a substrate interconnect extending above and below the bridge die.
- An electrically insulating layer made of a first material and an electrically insulating filler structure made of a second material are present in the multilayer substrate structure.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- High-speed data transmission systems
Problems Solved
This technology addresses:
- Improved signal integrity
- Enhanced reliability in interconnect structures
Benefits
The benefits of this technology include:
- Increased performance in electronic systems
- Enhanced durability and longevity of interconnect components
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Telecommunications industry for high-speed data transmission systems
Possible Prior Art
One possible prior art for this technology could be:
- Existing multilayer substrate structures with embedded dies and interconnects
Unanswered Questions
1. How does this technology compare to existing die interconnect substrates in terms of cost-effectiveness? 2. What specific industries or sectors would benefit the most from implementing this technology in their products?
Original Abstract Submitted
a die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. the die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconnect. the bridge die is embedded in the multilayer substrate structure. the substrate interconnect extends from a level above the bridge die to a level below the bridge die. the multilayer substrate structure further comprises an electrically insulating layer comprising a first electrically insulating material. the multilayer substrate structure further comprises an electrically insulating filler structure located laterally between the bridge die and the electrically insulating layer, wherein the electrically insulating filler structure comprises a second electrically insulating material different from the first electrically insulating material.
