Intel corporation (20240105582). LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS simplified abstract

LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS

Organization Name

intel corporation

Inventor(s)

Abhishek Anil Sharma of Portland OR (US)

Tahir Ghani of Portland OR (US)

Anand Murthy of Portland OR (US)

Wilfred Gomes of Portland OR (US)

Sagar Suthram of Portland OR (US)

Pushkar Ranade of San Jose CA (US)

LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105582 titled 'LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS

Simplified Explanation

The patent application describes an integrated circuit die with a high gain insulator material for capacitive coupling and a cooling structure to maintain low operating temperatures.

• The integrated circuit die includes a first conductive structure for an input of a capacitively coupled device.
• A second conductive structure aligned with the first conductive structure for a signal to be capacitively coupled to the input of the device.
• A first insulator material, specifically high gain insulator material, between the first and second conductive structures.
• A cooling structure to remove heat from the device, ensuring an operating temperature at or below 0°C.

Potential Applications

This technology could be used in various electronic devices that require efficient heat dissipation and precise signal transmission, such as sensors, communication systems, and medical devices.

Problems Solved

This innovation addresses the challenge of maintaining low operating temperatures in capacitively coupled devices, which can improve performance and reliability while reducing the risk of overheating.

Benefits

The use of high gain insulator material and a cooling structure allows for more efficient signal transmission and heat dissipation, leading to enhanced device performance and longevity.

Potential Commercial Applications

Potential commercial applications of this technology include the development of advanced sensors, communication systems, and medical devices that require precise signal transmission and reliable operation in various environments.

Possible Prior Art

One possible prior art could be the use of traditional insulator materials and cooling techniques in integrated circuit designs to address similar challenges of heat dissipation and signal transmission. However, the specific combination of high gain insulator material and a cooling structure as described in this patent application may be a novel approach to improving device performance and reliability.

How does the high gain insulator material impact signal transmission efficiency in the integrated circuit die?

The article does not provide specific details on how the high gain insulator material enhances signal transmission efficiency within the integrated circuit die. Further research or experimentation may be needed to understand the exact mechanisms at play.

What are the potential limitations or drawbacks of using a cooling structure to achieve low operating temperatures in the capacitively coupled device?

The article does not address any potential limitations or drawbacks of using a cooling structure for heat dissipation in the integrated circuit die. It would be important to investigate factors such as power consumption, size constraints, or maintenance requirements associated with the cooling structure to assess its overall effectiveness in practical applications.

Original Abstract Submitted

an integrated circuit die includes a first conductive structure for an input of a capacitively coupled device, a second conductive structure aligned with the first conductive structure for a signal to be capacitively coupled to the input of the capacitively coupled device, a first insulator material disposed between the first conductive structure and the second conductive structure, wherein the first insulator material comprises high gain insulator material, and a cooling structure operable to remove heat from the capacitively coupled device to achieve an operating temperature at or below 0� c. other embodiments are disclosed and claimed.