Intel corporation (20240105580). SURFACE FINISH WITH METAL DOME simplified abstract
Contents
- 1 SURFACE FINISH WITH METAL DOME
SURFACE FINISH WITH METAL DOME
Organization Name
Inventor(s)
Kristof Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Kyle Mcelhinny of Tempe AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
SURFACE FINISH WITH METAL DOME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105580 titled 'SURFACE FINISH WITH METAL DOME
Simplified Explanation
The abstract describes electronic packages and methods of forming such packages, including a core, pad, shell, surface finish, and solder resist. An opening is formed through the solder resist to expose the surface finish.
- Electronic package with core, pad, shell, surface finish, and solder resist
- Opening in solder resist to expose surface finish
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics where compact and efficient packaging is essential.
Problems Solved
This technology solves the problem of providing a reliable and efficient electronic package that protects the core components while allowing for easy access to the surface finish for further processing or connections.
Benefits
The benefits of this technology include improved protection of core components, enhanced connectivity through the exposed surface finish, and overall efficiency in electronic packaging processes.
Potential Commercial Applications
- "Innovative Electronic Packaging Technology for Consumer Electronics"
Possible Prior Art
There may be prior art related to electronic packaging methods and structures, but specific examples are not provided in this article.
Unanswered Questions
== How does this technology compare to traditional electronic packaging methods? This article does not provide a direct comparison between this technology and traditional electronic packaging methods. Further research or analysis would be needed to determine the specific differences and advantages.
== What are the potential cost implications of implementing this technology in electronic devices? The article does not discuss the cost implications of implementing this technology. Understanding the cost-effectiveness of this innovation would be crucial for companies considering its adoption.
Original Abstract Submitted
embodiments disclosed herein include electronic packages and methods of forming such packages. in an embodiment, the electronic package comprises a core, and a pad over the core. in an embodiment, a shell is around the core, and a surface finish is over the shell. in an embodiment, the electronic package further comprises a solder resist over the pad, where an opening is formed through the solder resist to expose the surface finish.
