Intel corporation (20240105577). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS simplified abstract
Contents
- 1 METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS
Organization Name
Inventor(s)
Zhenguo Jiang of Chandler AZ (US)
Zhiguo Qian of Chandler AZ (US)
Babita Dhayal of Aloha OR (US)
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105577 titled 'METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES WITH GROUNDING MEMBERS
Simplified Explanation
The patent application describes methods, systems, apparatus, and articles of manufacture for producing integrated circuit packages with grounding members.
- A semiconductor die includes a semiconductor substrate, metal interconnects near one side of the substrate, a metal contact near the opposite side of the substrate, a first grounding member extending from a grounding interconnect to a point in the substrate, and a second grounding member extending from the metal contact to another point in the substrate.
- The first grounding member is closer to the first side of the semiconductor substrate than the second grounding member.
Potential Applications
This technology could be applied in the manufacturing of integrated circuit packages for various electronic devices, such as smartphones, computers, and IoT devices.
Problems Solved
This technology helps in providing effective grounding solutions for integrated circuit packages, reducing the risk of electrical interference and improving overall performance and reliability of electronic devices.
Benefits
The use of grounding members in integrated circuit packages helps in maintaining signal integrity, reducing electromagnetic interference, and enhancing the overall functionality of electronic devices.
Potential Commercial Applications
The technology can be utilized by semiconductor manufacturers, electronics companies, and other industries involved in the production of electronic devices. A potential title for this section could be "Commercial Applications of Integrated Circuit Packages with Grounding Members".
Possible Prior Art
One possible prior art could be the use of traditional grounding techniques in integrated circuit packages to address signal integrity and electromagnetic interference issues.
Unanswered Questions
How does this technology impact the overall cost of manufacturing integrated circuit packages?
The article does not provide information on the cost implications of implementing this technology in the production process.
What are the specific performance improvements achieved by using grounding members in integrated circuit packages?
The article does not detail the specific performance enhancements resulting from the incorporation of grounding members in the semiconductor die.
Original Abstract Submitted
methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding members are disclosed. an example semiconductor die disclosed herein includes a semiconductor substrate, metal interconnects proximate a first side of the semiconductor substrate, a metal contact proximate a second side of the semiconductor substrate opposite the first side, a first grounding member extending from a grounding interconnect of the metal interconnects to a first distal point in the semiconductor substrate, and a second grounding member extending from the metal contact to a second distal point in the semiconductor substrate, the first distal point closer to the first side of the semiconductor substrate than the second distal point is to the first side of the semiconductor substrate.
