Intel corporation (20240105576). DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE simplified abstract

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DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE

Organization Name

intel corporation

Inventor(s)

Kyle Mcelhinny of Tempe AZ (US)

Xiaoying Guo of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

Haobo Chen of Gilbert AZ (US)

DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105576 titled 'DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS CORE

Simplified Explanation

The patent application abstract describes package substrates and methods of forming them, including a core, a pad over the core, a solder resist over the pad with an opening exposing a portion of the pad, and a surface finish over the pad and within the opening.

  • Package substrates with core, pad, solder resist, opening, and surface finish:
   - The package substrate includes a core, which serves as the base layer.
   - A pad is located over the core, providing a connection point for components.
   - A solder resist covers the pad, with an opening exposing part of the pad for soldering.
   - A surface finish is applied over the pad and within the opening, enhancing conductivity and protection.

Potential Applications

The technology described in this patent application could be used in various electronic devices and components, such as integrated circuits, printed circuit boards, and semiconductor packages.

Problems Solved

This technology solves the problem of providing a reliable and efficient package substrate for electronic components, ensuring proper connectivity and protection against environmental factors.

Benefits

The benefits of this technology include improved reliability, enhanced conductivity, increased durability, and better protection for electronic components.

Potential Commercial Applications

Potential commercial applications for this technology include the manufacturing of electronic devices, consumer electronics, telecommunications equipment, and automotive electronics.

Possible Prior Art

One possible prior art in this field could be the use of similar package substrates with core, pad, solder resist, and surface finish in electronic manufacturing processes.

Unanswered Questions

How does this technology compare to existing package substrate solutions in terms of cost-effectiveness and performance?

This article does not provide a direct comparison with existing package substrate solutions in terms of cost-effectiveness and performance. Further research and analysis would be needed to determine the specific advantages and disadvantages of this technology compared to others in the market.

What are the specific manufacturing processes involved in creating these package substrates, and how do they contribute to the overall quality of the final product?

The article does not delve into the specific manufacturing processes involved in creating these package substrates or how they contribute to the overall quality of the final product. Understanding the manufacturing processes and their impact on product quality would be crucial for implementing this technology effectively.


Original Abstract Submitted

embodiments disclosed herein include package substrates and methods of forming package substrates. in an embodiment, the package substrate comprises a core and a pad over the core. in an embodiment, a solder resist is over the pad, and an opening into the solder resist exposes a portion of the pad. in an embodiment, the package substrate further comprises a surface finish over the pad and within the opening.

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