Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
Contents
- 1 IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105571 titled 'IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS
Simplified Explanation
The abstract describes a patent application related to glass cores for electronic packages, including a substrate with a via opening and a diffusion layer.
- Glass cores for electronic packages
- Substrate with a via opening and a diffusion layer
Potential Applications
Glass cores with via openings and diffusion layers can be used in various electronic packaging applications, such as in semiconductor devices, sensors, and other electronic components.
Problems Solved
1. Improved thermal management in electronic packages 2. Enhanced electrical connectivity and signal transmission
Benefits
1. Increased reliability and durability of electronic packages 2. Enhanced performance of electronic components 3. Cost-effective manufacturing process
Potential Commercial Applications
Optimizing Glass Cores for Electronic Packages
Possible Prior Art
Prior art may include patents or publications related to glass substrates for electronic packaging, via openings in substrates, and diffusion layers in electronic components.
Unanswered Questions
How does the glass composition impact the performance of the electronic package?
The specific properties of the glass used in the core could affect factors such as thermal conductivity and mechanical strength.
What are the potential challenges in scaling up the manufacturing process for glass cores with via openings and diffusion layers?
Scaling up production may require addressing issues such as uniformity of the diffusion layer and precise control of via openings in larger substrates.
Original Abstract Submitted
embodiments disclosed herein include glass cores and methods of forming glass cores. in an embodiment, a core for an electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass, in an embodiment, a via opening is provided through the substrate, and a diffusion layer is along the first surface, the second surface, and the via opening.
