Intel corporation (20240103073). COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS simplified abstract

COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS

Organization Name

intel corporation

Inventor(s)

Patrick Pardy of Hillsboro OR (US)

Robert Wadell of Sacramento CA (US)

Tewodros Wondimu of Hillsboro OR (US)

Michael Apodaca of West Roxbury MA (US)

Joshua Freier of Portland OR (US)

Amir Raveh of Haifa (IL)

Eric Brummer of Orangevale CA (US)

COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240103073 titled 'COUPLING A THERMALLY CONDUCTIVE PLATE TO A SEMICONDUCTOR DEVICE FOR ELECTRON BEAM ANALYSIS

Simplified Explanation

The patent application describes an enclosure, or cartridge, that surrounds a semiconductor device before it undergoes testing with an electron beam. The enclosure includes a cooling plate with a thermal cooling mechanism to control the temperature of the semiconductor device during testing.

• The enclosure surrounds a semiconductor device before it is bombarded with an electron beam during testing.
• The cooling plate includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control its temperature.
• The thermal cooling mechanism may involve circulating a cooled fluid, air, or other cool material through a manifold in the plate.

Potential Applications

This technology could be applied in semiconductor testing facilities, research laboratories, and manufacturing plants where precise temperature control of semiconductor devices is crucial.

Problems Solved

1. Ensures the semiconductor device remains at the optimal temperature during testing. 2. Prevents overheating and potential damage to the semiconductor device.

Benefits

1. Improved accuracy and reliability of testing results. 2. Extends the lifespan of semiconductor devices by preventing overheating. 3. Enhances overall efficiency in semiconductor testing processes.

Potential Commercial Applications

Optimizing Semiconductor Testing with Thermal Cooling Enclosures

Possible Prior Art

There may be prior art related to thermal cooling mechanisms for semiconductor devices during testing, but specific examples are not provided in the patent application.

How does the cooling plate maintain a consistent temperature throughout the testing process?

The patent application does not detail the specific mechanisms or sensors used to ensure the temperature remains stable during testing.

What materials are commonly used for the cooling plate and manifold in similar technologies?

The patent application does not specify the materials typically used for the components of the cooling plate and manifold in similar technologies.

Original Abstract Submitted

embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for an enclosure, which may be referred to as a cartridge, that surrounds a semiconductor device prior to the semiconductor device being bombarded with an electron beam during operational testing. in embodiments, the enclosure may include a cooling plate that includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control the temperature of the semiconductor device during testing. the thermal cooling mechanism may include a manifold that extends through the plate through which a cooled fluid, cooled air, or some other cool material may be circulated to cool the semiconductor device. other embodiments may be described and/or claimed.