Huawei technologies co., ltd. (20240121881). HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD simplified abstract
Contents
- 1 HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
Organization Name
Inventor(s)
Xiaoyuan Ying of Shanghai (CN)
HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240121881 titled 'HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD
Simplified Explanation
The patent application describes a heat dissipation apparatus that includes a support mounted to a circuit board, a heat sink disposed on the support, and an elastic component providing pressure to tightly attach the heat sink to a heat source on the circuit board.
- Support mounted to a circuit board
- Assembly opening on a bearing portion in the support for accommodating a heat source
- Heat sink disposed on the bearing portion of the support
- Heat conducting surface of the heat sink penetrates the assembly opening to attach to the heat source
- Peak-valley structure in an elastic component on the heat sink as a force-applying portion
- Elastic component mounted to the support as mounting portions
Potential Applications
The technology can be applied in electronic devices, such as computers, servers, and other devices with heat dissipation requirements.
Problems Solved
This technology solves the problem of efficiently dissipating heat generated by electronic components to prevent overheating and potential damage.
Benefits
The benefits of this technology include improved heat dissipation efficiency, increased reliability of electronic devices, and potentially extending the lifespan of electronic components.
Potential Commercial Applications
The technology can be commercialized in the electronics industry for manufacturing heat dissipation solutions for various electronic devices.
Possible Prior Art
One possible prior art could be traditional heat sink designs without the use of an elastic component for applying pressure to the heat source.
Unanswered Questions
How does the elastic component provide pressure to attach the heat sink to the heat source effectively?
The elastic component, with its peak-valley structure, applies pressure evenly across the heat sink's surface, ensuring a tight attachment to the heat source.
What materials are commonly used in the construction of heat sinks for efficient heat dissipation?
Common materials used in heat sink construction include aluminum, copper, and their alloys due to their high thermal conductivity properties.
Original Abstract Submitted
a heat dissipation apparatus is disclosed. in the dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. a heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. a peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. at least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
