HIGH-FREQUENCY COMPONENT, ELECTRIC CIRCUIT ARRANGEMENT AND RADAR SYSTEM: abstract simplified (18182523)

• This abstract for appeared for patent application number 18182523 Titled 'HIGH-FREQUENCY COMPONENT, ELECTRIC CIRCUIT ARRANGEMENT AND RADAR SYSTEM'

Simplified Explanation

The abstract describes an electronic component designed for high-frequency applications. It consists of an integrated circuit with a chip that processes high-frequency signals. The chip is placed together with at least one signal coupling element or launcher, which helps in connecting or disconnecting high-frequency signals. All these components are housed in a common substrate. On the outside of the substrate, there is a land grid array (LGA) structure. Additionally, an electrically conductive border is present around each launcher on the surface of the substrate.

Original Abstract Submitted

An electronic component for high-frequency applications, in which an integrated circuit with a chip for processing high-frequency signals are arranged together with at least one signal coupling element or launcher for coupling and/or decoupling high-frequency signals in a common housing substrate. A land grid array (LGA) structure is provided on an outside of the housing substrate. An electrically conductive border is provided around the respective launcher on the surface of the housing substrate.