Google llc (20240114670). Component Shielding simplified abstract
Contents
- 1 Component Shielding
Component Shielding
Organization Name
Inventor(s)
Wen Shian Lin of New Taipei City (TW)
Chien Hua Hsu of New Taipei City (TW)
Shihwen Lee of New Taipei City (TW)
Bing-Feng Wang of New Taipei City (TW)
Component Shielding - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114670 titled 'Component Shielding
Simplified Explanation
The patent application describes techniques and apparatuses for component shielding, specifically focusing on a system with a printed circuit board (PCB), a device on the PCB, and a component shield with a wall structure and cover structure. The system also includes a housing structure and a shielding layer with an irregular cross-section.
- The system includes a printed circuit board (PCB) with a device and a component shield with a wall and cover structure.
- The housing structure is oriented parallel to the PCB, creating a shielded space for the device and component shield.
- A shielding layer with an irregular cross-section resides between the cover and housing structures, providing additional protection.
Potential Applications
This technology could be applied in electronic devices, telecommunications equipment, and industrial machinery to protect sensitive components from interference and damage.
Problems Solved
This innovation solves the problem of electromagnetic interference affecting electronic components and the risk of physical damage to delicate devices in various applications.
Benefits
The benefits of this technology include improved reliability and performance of electronic devices, increased durability of components, and enhanced protection against external factors.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, medical devices, aerospace systems, and automotive electronics, where shielding is crucial for optimal performance.
Possible Prior Art
One possible prior art could be existing component shielding techniques using traditional materials such as metal enclosures or conductive coatings to protect electronic components.
Unanswered Questions
How does the irregular cross-section of the shielding layer enhance protection for the components?
The irregular cross-section of the shielding layer may create additional barriers for electromagnetic interference and physical damage, but the specific mechanisms of this enhancement are not detailed in the abstract.
What materials are commonly used for the shielding layer in similar applications?
The abstract does not specify the materials used for the shielding layer, leaving a gap in understanding the common practices in the industry for component shielding.
Original Abstract Submitted
techniques and apparatuses directed to component shielding are described in this document. a first aspect relates to a system including a printed circuit board (pcb) oriented along a first plane, a device on the pcb, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. the system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. the first and second planes define a shielded space within which the component shield and the device reside. the system further includes a shielding layer residing at least partially between the cover and housing structures. the shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. the irregular cross-section includes a protrusion that extends from the third plane.
