Google llc (20240105581). SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING simplified abstract
Contents
- 1 SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
Organization Name
Inventor(s)
Jin Young Kim of Mountain View CA (US)
Zhonghua Wu of Fremont CA (US)
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105581 titled 'SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
Simplified Explanation
The abstract describes a substrate for coupling to an integrated circuit with multiple layers, each containing a repeating pattern of regions corresponding to power and ground. One layer has power and ground contacts for the integrated circuit, while another layer has contacts for another device. Additionally, at least one layer includes signal traces between the ground regions.
- The substrate for coupling to an integrated circuit has multiple layers with specific patterns for power and ground regions.
- One layer contains power and ground contacts for the integrated circuit, while another layer has contacts for a different device.
- Signal traces are present in at least one layer, extending between the ground regions.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Integrated circuit design
- Electronics manufacturing
- Semiconductor industry
Problems Solved
This technology helps address the following issues:
- Efficient power and ground distribution in integrated circuits
- Improved signal integrity in electronic devices
- Enhanced reliability of electronic connections
Benefits
The use of this technology offers several benefits, including:
- Better performance of integrated circuits
- Reduced electromagnetic interference
- Simplified design and manufacturing processes
Potential Commercial Applications
The innovative substrate design could find commercial applications in:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be the use of multilayer substrates in electronic devices to improve signal integrity and power distribution.
Unanswered Questions
How does this technology compare to existing multilayer substrate designs in terms of signal integrity and power distribution?
This article does not provide a direct comparison with existing multilayer substrate designs in terms of signal integrity and power distribution. Further research or testing may be needed to determine the specific advantages of this technology over existing solutions.
What are the potential challenges in implementing this technology in mass production of integrated circuits?
The article does not address the potential challenges in implementing this technology in mass production of integrated circuits. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations that need to be explored further.
Original Abstract Submitted
in some implementations, a substrate for coupling to an integrated circuit includes multiple layers. each of the multiple layers has, in a particular region of the substrate, a repeating pattern of regions corresponding to power and ground. the multiple layers include (i) a top layer having, in the particular region, power contacts and ground contacts for coupling to an integrated circuit and (ii) a bottom layer having, in the particular region, power contacts and ground contacts for coupling to another device. at least one layer of the multiple layers has a repeating pattern of signal traces that extend along and are located between the regions corresponding to ground in the at least one layer.
