Google llc (20240096859). Socket To Support High Performance Multi-die ASICs simplified abstract
Contents
- 1 Socket To Support High Performance Multi-die ASICs
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Socket To Support High Performance Multi-die ASICs - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Socket To Support High Performance Multi-die ASICs
Organization Name
Inventor(s)
Nam Hoon Kim of San Jose CA (US)
Jaesik Lee of San Jose CA (US)
Woon-Seong Kwon of Santa Clara CA (US)
Teckgyu Kang of Saratoga CA (US)
Socket To Support High Performance Multi-die ASICs - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096859 titled 'Socket To Support High Performance Multi-die ASICs
Simplified Explanation
The microelectronic system described in the patent application involves a microelectronic component with exposed electrically conductive elements, a socket mounted to the component with embedded substrate, microelectronic elements with active semiconductor devices and exposed contacts, and ground shielded coaxial socket pins mounted to the substrate.
- The microelectronic system includes a microelectronic component with exposed electrically conductive elements.
- A socket is mounted to the microelectronic component with a substrate embedded within.
- The system includes microelectronic elements with active semiconductor devices and exposed contacts.
- Ground shielded coaxial socket pins are mounted to and extend above the substrate.
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in providing a secure and reliable connection between microelectronic components and sockets, reducing the risk of electrical interference and improving overall performance.
Benefits
The use of ground shielded coaxial socket pins ensures better signal integrity and protection against electromagnetic interference, leading to enhanced reliability and functionality of microelectronic systems.
Potential Commercial Applications
The technology could find applications in the semiconductor industry, electronic manufacturing, and telecommunications sector, where high-performance microelectronic systems are required.
Possible Prior Art
One possible prior art could be the use of traditional socket pins without ground shielding, which may not provide the same level of signal integrity and protection against interference as the ground shielded coaxial socket pins described in the patent application.
Unanswered Questions
How does this technology compare to existing socket pin designs in terms of signal integrity and performance?
The article does not provide a direct comparison between the ground shielded coaxial socket pins and other types of socket pins in terms of signal integrity and performance.
What are the potential challenges or limitations of implementing this technology in mass production?
The article does not address any potential challenges or limitations that may arise when implementing this technology in mass production processes.
Original Abstract Submitted
a microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. the one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. the socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.
