Delphi technologies ip limited (20240105684). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract

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SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

Organization Name

delphi technologies ip limited

Inventor(s)

Kevin M. Gertiser of Carmel IN (US)

Chris Fruth of Kokomo IN (US)

SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105684 titled 'SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE

Simplified Explanation

The abstract describes a system with an inverter that converts DC power to AC power, featuring a power module with a flex layer, substrates, a semiconductor die, and a sinter element. The system also includes a battery to supply DC power and a motor to receive the AC power.

  • The inverter converts DC power to AC power.
  • The power module includes a flex layer, substrates, a semiconductor die, and a sinter element.
  • The battery supplies DC power to the inverter.
  • The motor receives AC power from the inverter.

Potential Applications

This technology could be applied in renewable energy systems, electric vehicles, and industrial machinery.

Problems Solved

This technology solves the problem of efficiently converting DC power to AC power for various applications.

Benefits

The benefits of this technology include improved energy efficiency, reliable power conversion, and reduced environmental impact.

Potential Commercial Applications

This technology could be commercially applied in solar power systems, electric vehicles, and grid-tied inverters for residential and commercial use.

Possible Prior Art

Prior art may include existing inverter systems with similar power conversion capabilities and components.

Unanswered Questions

How does the flex layer improve the performance of the inverter system?

The flex layer provides flexibility and allows for easier integration of components, but the specific performance benefits are not detailed in the abstract.

What is the expected lifespan of the semiconductor die in this system?

The abstract does not mention the expected lifespan or durability of the semiconductor die used in the inverter system.


Original Abstract Submitted

a system includes: an inverter configured to convert dc power to ac power, wherein the inverter includes: a power module including: a flex layer including a gate trace providing an electrical connection to a gate input connection of the power module, a first substrate, a second substrate including a source plane, the source plane including a step trench, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate trace, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery configured to supply the dc power to the inverter; and a motor configured to receive the ac power from the inverter.