Delphi technologies ip limited (20240105547). SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE simplified abstract
Contents
- 1 SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
Organization Name
delphi technologies ip limited
Inventor(s)
Edward Choi of Lake Orion MI (US)
SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105547 titled 'SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE
Simplified Explanation
The abstract describes a system with a power module that has interlocking features on one surface, and at least one heat sink with interlocking features and a layer of thermal interface material on its surface.
- The system includes a power module with interlocking features on one surface.
- At least one heat sink is included, with interlocking features and a layer of thermal interface material on its surface.
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems that require efficient heat dissipation, such as computers, servers, and power electronics.
Problems Solved
This technology addresses the issue of heat buildup in electronic devices, which can lead to performance degradation and even failure. By providing a thermal interface material between the power module and heat sink, heat dissipation can be improved, ensuring optimal performance and longevity of the device.
Benefits
- Improved heat dissipation efficiency - Enhanced performance and reliability of electronic devices - Extended lifespan of electronic components
Potential Commercial Applications
"Enhanced Heat Dissipation Technology for Electronic Devices"
Possible Prior Art
One possible prior art could be the use of thermal interface materials in electronic devices to improve heat dissipation. Another could be the integration of interlocking features in power modules and heat sinks for secure attachment and efficient heat transfer.
Unanswered Questions
How does the system handle different thermal loads and environmental conditions?
The patent abstract does not provide specific details on how the system adapts to varying thermal loads and environmental conditions. Further information on the system's flexibility and adaptability would be beneficial.
What materials are used for the interlocking features and thermal interface material?
The abstract does not mention the specific materials used for the interlocking features and thermal interface material. Understanding the materials' properties and compatibility with different electronic components would be essential for practical implementation.
Original Abstract Submitted
a system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
